公开(公告)号：US12066876B2

公开(公告)日：2024-08-20

申请号：US17571607

申请日：2022-01-10

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kuo-Chin Hung ,  Ching-Yuan Yang

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/02

CPC classification number: G06F1/203 ,  H05K5/0204 ,  H05K7/20136 ,  H05K7/20409 ,  H05K7/2049

Abstract: An electronic system includes an electronic device and a cooling device. The electronic device includes a housing, a heat source, a heat-conducting seat, and a heat-conducting block. The housing includes a space and at least one opening in communication with each other. The heat source and the heat-conducting seat are disposed in the space and contact with each. The heat-conducting seat faces the opening. The heat-conducting block is located at the opening and is connected to the housing. The cooling device includes a pressing portion and a cooling portion. The pressing portion presses the heat-conducting block, to cause the heat-conducting block to move into the space and abut against the heat-conducting seat, so that heat of the heat source is transferred to the pressing portion. The cooling portion is connected to the pressing portion, and dissipates the heat transferred to the pressing portion.