公开(公告)号：US11056770B2

公开(公告)日：2021-07-06

申请号：US16708593

申请日：2019-12-10

Applicant: ASUSTeK COMPUTER INC.

Inventor： Saou-Wen Su ,  Wei-Hsuan Chang

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q9/42 ,  H01Q5/378

Abstract: A multi-antenna system includes a conductive plane with four adjacent sides, a main antenna unit disposed on any one of the four sides, a first secondary antenna unit disposed on any one of the four side, a second secondary antenna unit disposed on any one of the four sides of the conductive plane except the side on which the main antenna unit is disposed, a switching circuit disposed on the conductive plane and is selectively electrically connected to the first secondary antenna unit or the second secondary antenna unit and a wireless communications module disposed on the conductive plane and electrically connected to the switching circuit and the main antenna unit. The first secondary antenna unit is spaced apart from the main antenna unit by a spacing, where the spacing is greater than 0.5 times a wavelength distance of a low-frequency operating frequency of the multi-antenna system.

公开(公告)号：US20210242580A1

公开(公告)日：2021-08-05

申请号：US17155195

申请日：2021-01-22

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Hsuan Chang ,  Fang-Hsien Chu

IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q1/24

Abstract: A broadband dual-antenna system provided herein comprises: a dielectric substrate including a first surface and a second surface; a grounding plane on the dielectric substrate; a loop metal branch located on the first surface and connected to the grounding plane; a coupling metal branch located on the second surface and connected to the grounding plane, the vertical projection of the coupling metal branch and that of the loop metal branch on the second surface partially overlap; a first metal branch located on the second surface and the coupling metal branch; a second metal branch located on the second surface and the coupling metal branch; a first signal source located on the second surface and connected to the first metal branch and the grounding plane; and a second signal source located on the second surface and connected to the second metal branch and the grounding plane.

公开(公告)号：US20210126368A1

公开(公告)日：2021-04-29

申请号：US17073496

申请日：2020-10-19

Applicant: ASUSTeK COMPUTER INC.

Inventor： Ya-Wen Hsiao ,  Saou-Wen Su ,  Wei-Hsuan Chang

IPC: H01Q7/00 ,  H01Q1/38 ,  H01Q1/48

Abstract: A loop-like dual-antenna system is provided. The loop-like dual-antenna system includes a dielectric substrate having a first surface and a second surface opposite to each other. The loop radiating element includes a first radiating part with two ends and a second radiating part opposite to the first radiating part. A first signal source is disposed on the first surface of the dielectric substrate and electrically connected to two ends of the first radiating part. A grounding part is disposed on the second surface of the dielectric substrate and disposed on one side of the dielectric substrate away from the first signal source. A coupling matching element is disposed on the second surface of the dielectric substrate and adjacent to the grounding part, for coupling to and exciting the second radiating part. A second signal source, disposed on the second surface of the dielectric substrate, and electrically connected to the coupling matching element and the grounding part.

公开(公告)号：US11081782B2

公开(公告)日：2021-08-03

申请号：US16669749

申请日：2019-10-31

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Hsuan Chang ,  Fang-Hsien Chu

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/36 ,  H01Q1/24

Abstract: A three-dimensional antenna element is provided. The three-dimensional antenna element is configured to be disposed on a surface of a conductive substrate, and includes a dielectric base, a first radiation part, a second radiation part, a third radiation part, a fourth radiation part, a first shorting element, and a second shorting element. The dielectric base includes a first plane and a second plane, where the second plane includes a first side and a second side, the first side is opposite to the second side and configured to be joined to the first plane, and the second side is configured to be joined to the surface of the conductive substrate. A signal feed-in point is coupled between the first radiation part and the second radiation part.