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公开(公告)号：US11108368B2
公开(公告)日：2021-08-31
申请号：US16808925
申请日：2020-03-04
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
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公开(公告)号：US11437695B2
公开(公告)日：2022-09-06
申请号：US16810974
申请日：2020-03-06
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.
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公开(公告)号：US11431069B2
公开(公告)日：2022-08-30
申请号：US16794320
申请日：2020-02-19
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
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Patent Agency Ranking
公开(公告)号：US20220014163A1
公开(公告)日：2022-01-13
申请号：US17458665
申请日：2021-08-27
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
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公开(公告)号：US12034425B2
公开(公告)日：2024-07-09
申请号：US17458665
申请日：2021-08-27
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
CPC classification number: H03H7/01 , H01L27/016 , H03H5/02 , H03H2001/0085
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
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公开(公告)号：US20200295727A1
公开(公告)日：2020-09-17
申请号：US16808925
申请日：2020-03-04
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
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公开(公告)号：US20200295432A1
公开(公告)日：2020-09-17
申请号：US16810974
申请日：2020-03-06
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.
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公开(公告)号：US20200280114A1
公开(公告)日：2020-09-03
申请号：US16794320
申请日：2020-02-19
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
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