-
公开(公告)号：US11108368B2
公开(公告)日：2021-08-31
申请号：US16808925
申请日：2020-03-04
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
-
公开(公告)号：US20190280361A1
公开(公告)日：2019-09-12
申请号：US16287089
申请日：2019-02-27
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
-
公开(公告)号：US11652265B2
公开(公告)日：2023-05-16
申请号：US17190776
申请日：2021-03-03
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
CPC classification number: H01P5/184 , H01P3/081 , H01P5/12 , H01P11/003 , H05K1/0237 , H05K1/115 , H04W88/08 , H05K2201/10098
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
-
公开(公告)号：US11437695B2
公开(公告)日：2022-09-06
申请号：US16810974
申请日：2020-03-06
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.
-
公开(公告)号：US11431069B2
公开(公告)日：2022-08-30
申请号：US16794320
申请日：2020-02-19
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
-
Patent Agency Ranking
公开(公告)号：US20220014163A1
公开(公告)日：2022-01-13
申请号：US17458665
申请日：2021-08-27
Applicant: AVX Corporation
Inventor： Michael Marek , Elinor O'Neill , Ronit Nissim
Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
-
公开(公告)号：US20210305176A1
公开(公告)日：2021-09-30
申请号：US17344086
申请日：2021-06-10
Applicant: AVX Corporation
Inventor： Yehuda Seidman , Elinor O'Neill , Dan Rozbroj
IPC: H01L23/00 , H01L23/498 , H01L21/768 , H01L23/64
Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
-
公开(公告)号：US11056444B2
公开(公告)日：2021-07-06
申请号：US16655280
申请日：2019-10-17
Applicant: AVX Corporation
Inventor： Yehuda Seidman , Elinor O'Neill , Dan Rozbroj
IPC: H01L23/00 , H01L23/498 , H01L23/64 , H01L21/768
Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
-
公开(公告)号：US20210184327A1
公开(公告)日：2021-06-17
申请号：US17190776
申请日：2021-03-03
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
-
公开(公告)号：US20200352026A1
公开(公告)日：2020-11-05
申请号：US16850160
申请日：2020-04-16
Applicant: AVX Corporation
Inventor： Dan Rozbroj , Yehuda Seidman , Elinor O'Neill
IPC: H05K1/02 , H01H69/02 , H01L23/525 , H01H85/041
Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.027 seconds)
