公开(公告)号：US20220367306A1

公开(公告)日：2022-11-17

申请号：US17317762

申请日：2021-05-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia-Pin CHEN ,  Chia-Sheng TIEN ,  Wan-Ting CHIU ,  Chi Long TSAI

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18 ,  H01L25/065

Abstract: An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.