公开(公告)号：US20200098700A1

公开(公告)日：2020-03-26

申请号：US16138937

申请日：2018-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Chien-Feng CHAN

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/48 ,  H01L21/56

Abstract: A semiconductor package device includes a substrate, a sealant, a trench, a spacer and a conductive material. The substrate includes a first surface, a second surface opposite the first surface, and a lateral surface extending from the first surface to the second surface. The sealant is disposed on the first surface of the substrate and includes a first surface and a second surface opposite the first surface. The trench passes through the sealant and includes a first portion adjacent to the first surface of the sealant and a second portion between the first portion and the substrate. A width of the first portion is greater than a width of the second portion. The spacer is disposed in the trench and in contact with the sealant. The conductive material is disposed in the trench and encapsulates the spacer.