公开(公告)号：US20240329387A1

公开(公告)日：2024-10-03

申请号：US18127622

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Jr-Wei LIN ,  Pei-Jung YANG

IPC: G02B26/08

CPC classification number: G02B26/0816

Abstract: An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.

公开(公告)号：US20240113061A1

公开(公告)日：2024-04-04

申请号：US18530123

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20240094460A1

公开(公告)日：2024-03-21

申请号：US17949143

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/30

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/305

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.

公开(公告)号：US20240411096A1

公开(公告)日：2024-12-12

申请号：US18208226

申请日：2023-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Sin-Yuan MU

IPC: G02B6/43

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.

公开(公告)号：US20230081194A1

公开(公告)日：2023-03-16

申请号：US17472328

申请日：2021-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Jung Jui KANG

IPC: G02B6/43 ,  G02B6/42

Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

公开(公告)号：US20220196918A1

公开(公告)日：2022-06-23

申请号：US17129644

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/30

Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

公开(公告)号：US20200098700A1

公开(公告)日：2020-03-26

申请号：US16138937

申请日：2018-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Chien-Feng CHAN

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/48 ,  H01L21/56

Abstract: A semiconductor package device includes a substrate, a sealant, a trench, a spacer and a conductive material. The substrate includes a first surface, a second surface opposite the first surface, and a lateral surface extending from the first surface to the second surface. The sealant is disposed on the first surface of the substrate and includes a first surface and a second surface opposite the first surface. The trench passes through the sealant and includes a first portion adjacent to the first surface of the sealant and a second portion between the first portion and the substrate. A width of the first portion is greater than a width of the second portion. The spacer is disposed in the trench and in contact with the sealant. The conductive material is disposed in the trench and encapsulates the spacer.

公开(公告)号：US20240379567A1

公开(公告)日：2024-11-14

申请号：US18780208

申请日：2024-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20240142727A1

公开(公告)日：2024-05-02

申请号：US18408502

申请日：2024-01-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Sin-Yuan MU ,  Chia-Sheng CHENG

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/125 ,  G02B6/30 ,  G02B6/43

CPC classification number: G02B6/4214 ,  G02B6/12002 ,  G02B6/125 ,  G02B6/30 ,  G02B6/4204 ,  G02B6/4245 ,  G02B6/43 ,  G02B6/02038

Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.

公开(公告)号：US20240019647A1

公开(公告)日：2024-01-18

申请号：US17866400

申请日：2022-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/42

CPC classification number: G02B6/4231 ,  G02B6/4206

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.