公开(公告)号：US12119282B2

公开(公告)日：2024-10-15

申请号：US17876468

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching Pi ,  Yen-Chi Huang ,  Hao-Chih Hsieh ,  Jin Han Shih

IPC: H01L21/56 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L23/3157 ,  H01L21/565 ,  H01L21/568 ,  H05K1/185

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.