公开(公告)号：US11776863B2

公开(公告)日：2023-10-03

申请号：US17404912

申请日：2021-08-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tun-Ching Pi ,  Sung-Hung Chiang ,  Yu-Chang Chen

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L23/40

CPC classification number: H01L23/13 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2023/4087

Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

公开(公告)号：US11094602B2

公开(公告)日：2021-08-17

申请号：US16537371

申请日：2019-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tun-Ching Pi ,  Sung-Hung Chiang ,  Yu-Chang Chen

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L23/40

Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

公开(公告)号：US12119282B2

公开(公告)日：2024-10-15

申请号：US17876468

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching Pi ,  Yen-Chi Huang ,  Hao-Chih Hsieh ,  Jin Han Shih

IPC: H01L21/56 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L23/3157 ,  H01L21/565 ,  H01L21/568 ,  H05K1/185

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

公开(公告)号：US12185475B2

公开(公告)日：2024-12-31

申请号：US17239475

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching Pi ,  Ming-Hung Chen

IPC: H05K1/02 ,  A61B5/00 ,  G06F1/16 ,  H05K3/34

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

公开(公告)号：US11437322B2

公开(公告)日：2022-09-06

申请号：US16560862

申请日：2019-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tun-Ching Pi ,  Sung-Hung Chiang ,  Yu-Chang Chen

IPC: H01L23/538 ,  H01L23/13 ,  H01L25/16 ,  H01L23/552 ,  H01L23/31

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

公开(公告)号：US12165984B2

公开(公告)日：2024-12-10

申请号：US17903921

申请日：2022-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tun-Ching Pi ,  Sung-Hung Chiang ,  Yu-Chang Chen

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L23/552 ,  H01L25/16

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

公开(公告)号：US12148679B2

公开(公告)日：2024-11-19

申请号：US17169230

申请日：2021-02-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching Pi

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.

公开(公告)号：US10083911B2

公开(公告)日：2018-09-25

申请号：US15428069

申请日：2017-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tun-Ching Pi

IPC: H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/5387 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/58 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/15192

Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.