公开(公告)号：US11811957B2

公开(公告)日：2023-11-07

申请号：US17324958

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Chung Ju Yu ,  Jui-Hsien Wang ,  Chai-Chi Lin ,  Hong Jie Chen

IPC: H04M1/02 ,  H01L25/16 ,  H01L23/498

CPC classification number: H04M1/0202 ,  H01L23/4985 ,  H01L25/16

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.