公开(公告)号：US20220392871A1

公开(公告)日：2022-12-08

申请号：US17338600

申请日：2021-06-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi LEE ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Li Chieh CHEN

IPC: H01L25/065 ,  H01L23/538

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

公开(公告)号：US20230207524A1

公开(公告)日：2023-06-29

申请号：US18115743

申请日：2023-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi LEE ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Li Chieh CHEN

IPC: H01L25/065 ,  H01L23/538

CPC classification number: H01L25/0655 ,  H01L23/5387 ,  H01L23/5386 ,  H01L23/5385

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

公开(公告)号：US20250022848A1

公开(公告)日：2025-01-16

申请号：US18904050

申请日：2024-10-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi LEE ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Li Chieh CHEN

IPC: H01L25/065 ,  H01L23/538

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.