公开(公告)号：US11158596B2

公开(公告)日：2021-10-26

申请号：US16825725

申请日：2020-03-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Ying-Nan Liu ,  Min-Yao Cheng

IPC: H01L23/00

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

公开(公告)号：US11848296B2

公开(公告)日：2023-12-19

申请号：US17511472

申请日：2021-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Ying-Nan Liu ,  Min-Yao Cheng

IPC: H01L23/00

CPC classification number: H01L24/35 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/14 ,  H01L2924/19107

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.