公开(公告)号：US10410942B2

公开(公告)日：2019-09-10

申请号：US15823467

申请日：2017-11-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsan-Hsien Chen ,  Ian Hu ,  Jin-Feng Yang ,  Shih-Wei Chen ,  Hui-Chen Hsu

IPC: H01L23/34 ,  H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.