公开(公告)号：US20250167092A1

公开(公告)日：2025-05-22

申请号：US18518322

申请日：2023-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Li LU ,  Cheng-Nan LIN

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes a first module having a first electronic component, a second module at least partially overlapped with the first module and having an encapsulant, and a first power path penetrating through the encapsulant and providing a first power signal to a backside surface of the first electronic component.

公开(公告)号：US20250079323A1

公开(公告)日：2025-03-06

申请号：US18240327

申请日：2023-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Li LU

IPC: H01L23/538 ,  H01L23/36 ,  H01L25/10

Abstract: An electronic device is disclosed. The electronic device includes an interposer, a voltage regulator, a first circuit structure, and an electronic component. The voltage regulator is attached to the interposer. The first circuit structure is supported by the interposer. The electronic component is disposed adjacent to the interposer and electrically connected to the voltage regulator through the first circuit structure and the interposer.