-
1.发明授权Method for processing a substrate using a system having a roller with treading 有权使用具有踩踏辊的系统来处理基板的方法
公开(公告)号：US6059889A
公开(公告)日：2000-05-09
申请号：US227173
申请日：1999-01-07
CPC分类号： H01L21/67046 , B08B1/04 , B08B11/02 , Y10S134/902
摘要： A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.
摘要翻译： 一种用于在双面清洗工艺中旋转晶片的方法，其中旋转辊在双面清洁过程中向半导体晶片施加旋转运动。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 该辊子具有外边缘，该外缘具有凹槽，晶片边缘被夹在该凹槽中。 从凹槽沟槽液体离开凹槽延伸的胎面或沟槽，以防止在旋转时晶片滑动，并将清洁溶液施加到晶片上。
-
公开(公告)号：US5862560A
公开(公告)日：1999-01-26
申请号：US705337
申请日：1996-08-29
CPC分类号： H01L21/67046 , B08B1/04 , B08B11/02 , Y10S134/902
摘要： A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.
摘要翻译： 一种用于在双面清洗器中旋转晶片的方法和装置，其中在双面清洁过程中旋转辊向半导体晶片施加旋转运动。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 该辊子具有外边缘，该外缘具有凹槽，晶片边缘被夹在该凹槽中。 从凹槽沟槽液体离开凹槽延伸的胎面或沟槽，以防止在旋转时晶片滑动，并将清洁溶液施加到晶片上。
-
搜索结果
2 条记录 (耗时 0.022 秒)