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8 条记录 (耗时 0.011 秒)

    Roller with treading and system including the same
    2.
    发明授权
    Roller with treading and system including the same 失效
    滚轮与踩踏和系统包括相同

    公开(公告)号：US5862560A

    公开(公告)日：1999-01-26

    申请号：US705337

    申请日：1996-08-29

    申请人： Alan J. Jensen ,  Norman A. Mertke ,  William Dyson, Jr. ,  Lynn Ryle ,  Patrick Paino

    发明人： Alan J. Jensen ,  Norman A. Mertke ,  William Dyson, Jr. ,  Lynn Ryle ,  Patrick Paino

    IPC分类号： B08B3/00 ,  B08B1/04 ,  B08B11/02 ,  H01L21/00 ,  H01L21/304 ,  B08B3/02 ,  B08B11/00

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B11/02 ,  Y10S134/902

    摘要： A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

    摘要翻译： 一种用于在双面清洗器中旋转晶片的方法和装置，其中在双面清洁过程中旋转辊向半导体晶片施加旋转运动。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 该辊子具有外边缘，该外缘具有凹槽，晶片边缘被夹在该凹槽中。 从凹槽沟槽液体离开凹槽延伸的胎面或沟槽，以防止在旋转时晶片滑动，并将清洁溶液施加到晶片上。

    Automatically adjustable brush assembly for cleaning semiconductor wafers
    6.
    发明授权
    Automatically adjustable brush assembly for cleaning semiconductor wafers 失效
    用于清洁半导体晶片的自动可调刷组件

    公开(公告)号：US5475889A

    公开(公告)日：1995-12-19

    申请号：US275774

    申请日：1994-07-15

    申请人： David L. Thrasher ,  Lynn Ryle

    发明人： David L. Thrasher ,  Lynn Ryle

    IPC分类号： B08B1/04 ,  B21B45/06 ,  H01L21/00 ,  H01L21/304 ,  A46B13/02

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  B21B45/06

    摘要： An automatically adjustable brush assembly for cleaning semiconductor wafers. The brush assembly includes a first rotary brush, a brush carriage having first and second arms and a second rotary brush, and at least one pressure adjustment assembly positioned to engage at least one of the arms of the brush carriage and configured for automatically adjusting the pressure applied to the wafer surfaces by the first and second rotary brushes. The brush assembly further includes a control system coupled to the pressure adjustment assembly for controlling operation of the pressure adjustment assembly to selectively increase and decrease the pressure applied to the wafer by the first and second rotary brushes.

    摘要翻译： 一种用于清洁半导体晶片的自动调节刷组件。 刷组件包括第一旋转刷，具有第一臂和第二臂的刷架和第二旋转刷，以及至少一个压力调节组件，其定位成与刷架的至少一个臂接合，并被构造成用于自动调节压力 通过第一和第二旋转刷施加到晶片表面。 刷组件还包括耦合到压力调节组件的控制系统，用于控制压力调节组件的操作，以选择性地增加和减少由第一和第二旋转刷施加到晶片的压力。