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公开(公告)号：US10465295B2
公开(公告)日：2019-11-05
申请号：US15312799
申请日：2015-05-19
Applicant: Alpha Assembly Solutions Inc
Inventor： Steven Prokopiak , Ellen S. Tormey , Oscar Khaselev , Michael T. Marczi , Bawa Singh
IPC: C23F1/16 , C23F1/02 , H01L21/3213 , H01L31/18 , H01L31/0224 , H01L31/0216 , H01L31/0236
Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents,
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