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Patent Agency Ranking
公开(公告)号：US11054193B2
公开(公告)日：2021-07-06
申请号：US15993048
申请日：2018-05-30
Applicant: Amazon Technologies, Inc.
Inventor： Jonathan Barak Flowers
Abstract: A vehicle such as an unmanned aerial vehicle (UAV) can include a heat-generating electronic device coupled with a heat exhaust element by a vibration isolating thermal connector. The thermal connector includes a first heat-conducting element configured to draw heat from the electronic device, a second heat-conducting element separated from the first heat-conducting element, and a flexible seal connected with the first and second heat-conducting elements and defining an enclosed cavity between the elements. The enclosed cavity contains a heat conducting liquid, and allows limited movement of the first and second heat conducting elements with respect to each other while maintaining thermal connection.
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2.发明授权公开(公告)号：US12259260B1
公开(公告)日：2025-03-25
申请号：US18064780
申请日：2022-12-12
Applicant: Amazon Technologies, Inc.
Inventor： Jonathan Barak Flowers , Andrew Ferguson , Asintha Nanayakkara , David M. Birch , Paul Nathan
Abstract: A rain-resistant, drainless, heated air data probe assembly may comprise a probe having a central channel, one or more peripheral channels, and a heating element. In addition, inner surfaces of the channels may include hydrophilic surfaces, and the outer surface of the probe may include hydrophobic surfaces. The hydrophobic outer surface may reduce water ingress into the channels of the probe, and the hydrophilic inner surfaces may cause dispersion of water that has entered the channels. The heating element may further cause evaporation or running off of water on the outer surface, and may cause evaporation of dispersed water within the channels, which may further eliminate the need for a drain at a terminal end of the probe assembly.
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公开(公告)号：US11062824B2
公开(公告)日：2021-07-13
申请号：US16175475
申请日：2018-10-30
Applicant: Amazon Technologies, Inc.
Inventor： Jonathan Barak Flowers , Herbert Mehnert
Abstract: Fluidic channels and pumps for active cooling of cables are described. One cable assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. A first pump connector is coupled to a first end of the fluidic channel structure and a second pump connector is coupled to a second end of the fluidic channel structure. Motion of liquid metal, when pumped through the fluidic channel structure, distributes heat away from the conductor.
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公开(公告)号：US10912224B2
公开(公告)日：2021-02-02
申请号：US15993137
申请日：2018-05-30
Applicant: Amazon Technologies, Inc.
Inventor： Jonathan Barak Flowers
Abstract: A vibration isolating thermally conductive connector includes a first thermally conductive element configured to draw heat from a heat source, a second thermally conductive element separated from the first thermally conductive element, and a flexible seal connected with the first and second thermally conductive elements and defining an enclosed cavity between the elements. The enclosed cavity contains a thermally conductive liquid, and allows limited movement of the second and first thermally conductive elements with respect to each other while maintaining thermal connection.
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公开(公告)号：US10660199B1
公开(公告)日：2020-05-19
申请号：US16175456
申请日：2018-10-30
Applicant: Amazon Technologies, Inc.
Inventor： Jonathan Barak Flowers , Herbert Mehnert
Abstract: Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.
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