公开(公告)号：US11531383B1

公开(公告)日：2022-12-20

申请号：US17039950

申请日：2020-09-30

Applicant: Amazon Technologies, Inc.

Inventor： Steve Qingjun Cai ,  Ismael Medrano

IPC: G06F1/20 ,  H05K7/20

Abstract: A computer system includes a mist cooling system. The mist cooling system suspended droplets of dielectric fluid in air to form a mist and conveys the mist to heat producing components of the computer system. The liquid droplets of the mist wet the heat producing components and remove waste heat as part of a phase change from a liquid phase to a vapor phase. Vaporized dielectric fluid is condensed via a heat exchanger in a chassis of the computer system and is returned to a reservoir for use in generating mist.

公开(公告)号：US11744037B1

公开(公告)日：2023-08-29

申请号：US17361005

申请日：2021-06-28

Applicant: Amazon Technologies, Inc.

Inventor： Steve Qingjun Cai ,  Ismael Medrano

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20727

Abstract: An airflow duct can be arranged at least in part in a zone alongside an electronics board mounted to a motherboard. The airflow duct can include an inlet end arranged to receive airflow into the airflow duct. A closed end wall can be arranged opposite the inlet end. A set of walls may extend from the inlet end to the closed end wall and include a top wall, a bottom wall, a first lateral side wall, and a second lateral side wall. Orifices can be included in the set of walls and can be arranged to direct airflow from within the airflow duct toward heat-producing components borne by the electronics board.

公开(公告)号：US11406041B1

公开(公告)日：2022-08-02

申请号：US16831411

申请日：2020-03-26

Applicant: Amazon Technologies, Inc.

Inventor： Steve Qingjun Cai ,  Unnikrishnan Vadakkanmaruveedu

IPC: H05K7/20 ,  G06F1/20 ,  F28D15/00

Abstract: An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.