公开(公告)号：US10101414B2

公开(公告)日：2018-10-16

申请号：US15000006

申请日：2016-01-18

Applicant: Analog Devices Global

Inventor： Jan Kubik ,  Seamus P. Whiston ,  Padraig Michael Doran

IPC: G01R33/02 ,  G01R33/09

Abstract: Thin film resistive sensors typically include a number of resistive components. These components should be well matched in order for the sensor to provide accurate readings. When a sensor is incorporated within an integrated circuit, the resistive components may be formed over, or under, metallic traces that form part of other components. As a result, the thin film resistive components are subjected to different levels of stress. This disclosure provides a structure that is arranged to mitigate the effects of stress.

公开(公告)号：US20170131368A1

公开(公告)日：2017-05-11

申请号：US15000006

申请日：2016-01-18

Applicant: Analog Devices Global

Inventor： Jan Kubik ,  Seamus P. Whiston ,  Padraig Michael Doran

IPC: G01R33/09

CPC classification number: G01R33/09 ,  G01R33/096

Abstract: Thin film resistive sensors typically include a number of resistive components. These components should be well matched in order for the sensor to provide accurate readings. When a sensor is incorporated within an integrated circuit, the resistive components may be formed over, or under, metallic traces that form part of other components. As a result, the thin film resistive components are subjected to different levels of stress. This disclosure provides a structure that is arranged to mitigate the effects of stress.