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公开(公告)号：US12287680B1
公开(公告)日：2025-04-29
申请号：US18660116
申请日：2024-05-09
Applicant: Apple Inc.
Inventor： Supratik Datta , Karan S. Jain , Ehsan Khajeh , Arash Akhavan Fomani , Daniel P Kumar , Eng Eow Goh , Meng Chi Lee , Gang Ning , Andrew W. Joyce , Chengrui Zhang , Stephen T. Schooley , Timothy C. Wulff , Ross D. Arriens , Hao Dong , Michael Sipper , Jenna Dancy , Deepak Sharma , Parin Patel
Abstract: A case for an electronic device can include a case body including an exterior surface and an interior surface, the interior surface being positioned opposite the exterior surface. The case can additionally include a button body positioned at least partially within the case body between the exterior surface and the interior surface, the button body being movable inward and outward relative to the case body along an axis of button travel. The case can further include a biasing structure having a contact surface configured to contact the button body, the biasing structure configured to bias the button body toward the interior surface along the axis of button travel.
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公开(公告)号：US20220317271A1
公开(公告)日：2022-10-06
申请号：US17709270
申请日：2022-03-30
Applicant: Apple Inc.
Inventor： Gordon S. Franza , Gregory T. Minteer , Mohammad Yeke Yazdandoost , Dale Setlak , Marcus C. Yip , Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Brian M. King , Giovanni Gozzini , Jason S. Griesbach
Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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公开(公告)号：US12135855B2
公开(公告)日：2024-11-05
申请号：US18202620
申请日：2023-05-26
Applicant: Apple Inc.
Inventor： Andrew Deng , Timothy D. Koch , Hui-Shan Chang , Andrew W. Joyce , Henry H. Yang , Ran Xu , Patrick E. O'Brien , Yu Hsuan Chao , Dale Setlak , Giovanni Gozzini
Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.
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公开(公告)号：US11330351B2
公开(公告)日：2022-05-10
申请号：US17020564
申请日：2020-09-14
Applicant: Apple Inc.
Inventor： Stephanie Y. Su , Brittany Judoprasetijo , Andrew Deng , Dale Setlak , Carli E. Oster , Melody L. Kuna , Andrew W. Joyce , Ran Xu
IPC: G06K9/00 , H04R1/02 , H01Q1/24 , H01Q1/38 , H01Q1/44 , G06F3/041 , H05K5/02 , H04R1/28 , H01Q9/04
Abstract: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The display and the housing can define an internal volume and a speaker assembly can be positioned in the internal volume. The speaker assembly can include a speaker enclosure sealed to the housing within the internal volume, the speaker enclosure and the housing defining a speaker volume, and a speaker module in fluid communication with the speaker volume, the speaker module including a diaphragm positioned at an aperture defined by the speaker volume, the diaphragm defining multiple ridges.
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公开(公告)号：US12067196B2
公开(公告)日：2024-08-20
申请号：US18106226
申请日：2023-02-06
Applicant: Apple Inc.
Inventor： Marcus C. Yip , Brian M. King , Jason S. Griesbach , Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Giovanni Gozzini , Mohammad Yeke Yazdandoost , Gordon S. Franza
CPC classification number: G06F3/0436 , G06F3/04166
Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20230185407A1
公开(公告)日：2023-06-15
申请号：US18106226
申请日：2023-02-06
Applicant: Apple Inc.
Inventor： Marcus C. Yip , Brian M. King , Jason S. Griesbach , Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Giovanni Gozzini , Mohammad Yeke Yazdandoost , Gordon S. Franza
CPC classification number: G06F3/0436 , G06F3/04166
Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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7.发明申请公开(公告)号：US20210124460A1
公开(公告)日：2021-04-29
申请号：US17141658
申请日：2021-01-05
Applicant: Apple Inc.
Inventor： Daniel J. Bechstein , Collin R. Petty , Martin P. Grunthaner , Andrew W. Joyce , John R. Matthews , Pavan O. Gupta , Albert Lin
IPC: G06F3/044
Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.
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公开(公告)号：US20200064952A1
公开(公告)日：2020-02-27
申请号：US16549990
申请日：2019-08-23
Applicant: Apple Inc.
Inventor： Pavan O. Gupta , Andrew W. Joyce , Benedict Drevniok , Mo Li , David S. Graff , Albert Lin , Julian K. Shutzberg , Hojjat Seyed Mousavi
Abstract: A device includes a housing defining part of an interior volume and an opening to the interior volume; a cover mounted to the housing to cover the opening and further define the interior volume; a display mounted within the interior volume and viewable through the cover; and a system in package (SiP) mounted within the interior volume. The SiP includes a self-capacitance sense pad adjacent a first surface of the SiP; a set of solder structures attached to a second surface of the SiP, the second surface opposite the first surface; and an IC coupled to the self-capacitance sense pad and configured to output, at one or more solder structures in the set of solder structures, a digital value related to a measured capacitance of the self-capacitance sense pad. The SiP is mounted within the interior volume with the first surface positioned closer to the cover than the second surface.
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公开(公告)号：US20230418421A1
公开(公告)日：2023-12-28
申请号：US18202620
申请日：2023-05-26
Applicant: Apple Inc.
Inventor： Andrew Deng , Timothy D. Koch , Hui-Shan Chang , Andrew W. Joyce , Henry H. Yang , Ran Xu , Patrick E. O'Brien , Yu Hsuan Chao , Dale Setlak , Giovanni Gozzini
CPC classification number: G06F3/0445 , G06F3/04144
Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.
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公开(公告)号：US11573665B2
公开(公告)日：2023-02-07
申请号：US17709251
申请日：2022-03-30
Applicant: Apple Inc.
Inventor： Marcus C. Yip , Brian M. King , Jason S. Griesbach , Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Giovanni Gozzini , Mohammad Yeke Yazdandoost , Gordon S. Franza
Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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