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公开(公告)号:US20220100833A1
公开(公告)日:2022-03-31
申请号:US17471031
申请日:2021-09-09
申请人: Apple Inc.
发明人: Timothy D. Koch , Dylan L. Magida , Michael B. Wittenberg , Henry H. Yang , Alvin T. Chang , Steven C. Roach , Jared P. Ostdiek
IPC分类号: G06F21/32 , G06K9/00 , H04B1/3827 , G06F1/16
摘要: A portable electronic device may include a housing member defining a side surface of the portable electronic device, a portion of the housing member defining a side wall of a hole extending through the housing member, a button member positioned along the side surface and defining a chassis portion and a hollow post extending into the hole defined through the housing member, and a first waterproof seal defined between the hollow post and the side wall of the hole. The portable electronic device may also include a biometric sensing component coupled to the chassis portion, a flexible circuit element extending through the hollow post and conductively coupling the biometric sensing component to a component within the housing, and a second waterproof seal defined within the hollow post.
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公开(公告)号:US20210271843A1
公开(公告)日:2021-09-02
申请号:US17326202
申请日:2021-05-20
申请人: Apple Inc.
发明人: Mohammad Yeke Yazdandoost , Giovanni Gozzini , Brian Michael King , Marcus Yip , Marduke Yousefpor , Ehsan Khajeh , Aaron Tucker , Henry H. Yang
IPC分类号: G06K9/00 , A61B5/1172 , A61B8/00
摘要: An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.
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公开(公告)号:US20190236257A1
公开(公告)日:2019-08-01
申请号:US16378306
申请日:2019-04-08
申请人: Apple Inc.
发明人: Matthew E. Last , Giovanni Gozzini , Henry H. Yang
CPC分类号: G06F21/35 , G06F21/31 , G06F21/32 , G06K9/0002 , G06K9/00087
摘要: A hardware security token in contact with a user's body can send a signal via interbody communication to one or more electronic devices associated with a system of electronic devices having unified access controls such that a user can access each of the electronic devices using the same credentials. The signal sent by the hardware security token can be deputized by a user in possession of credentials to the system as a temporary proxy for that user's identity. In other examples, the signal sent by the portable security token can be deputized by a user in possession of credentials to the system as a temporary proxy for another user's identity. In some embodiments, the proxy can expire after a period of time or after a particular event occurs.
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公开(公告)号:US09804003B2
公开(公告)日:2017-10-31
申请号:US14687438
申请日:2015-04-15
申请人: Apple Inc.
发明人: Henry H. Yang
CPC分类号: G01D11/245 , G01D11/30 , G01N33/0004 , H01L2224/48137 , H01L2224/48227 , H01L2924/15192 , H01L2924/16151 , H01L2924/16251 , H04M2250/12 , H04R1/021 , H04R1/04 , H04R2499/11
摘要: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
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公开(公告)号:US20140112510A1
公开(公告)日:2014-04-24
申请号:US13658316
申请日:2012-10-23
申请人: APPLE INC.
发明人: Henry H. Yang , Matthew E. Last , Romain A. Teil
CPC分类号: H04R1/021 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H01L2924/16152 , H04M2250/12 , H04R1/04 , H04R2499/11 , H01L2924/00014
摘要: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
摘要翻译: 电子设备可以设置有环境传感器。 环境传感器可以包括一个或多个环境传感器部件和一个或多个声学部件。 声学部件可以包括扬声器或麦克风。 环境传感器部件可以包括温度传感器,压力传感器,湿度传感器或用于感测设备周围环境的属性的其他传感器或传感器组合。 环境传感器可以具有带开口的外壳。 外壳可以由刚性支撑结构和印刷电路的一部分形成。 开口可以形成在刚性支撑结构或印刷电路中。 用于环境传感器的外壳中的开口可与装置的外部结构构件中的开口对准。 外部结构构件可以是用于装置显示器的壳体结构或覆盖层。
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6.
公开(公告)号:US12039800B2
公开(公告)日:2024-07-16
申请号:US17709235
申请日:2022-03-30
申请人: Apple Inc.
发明人: Gordon S. Franza , Mohammad Yeke Yazdandoost , Dale Setlak , Marcus C. Yip , Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Brian M. King , Giovanni Gozzini , Jason S. Griesbach , Henry H. Yang
CPC分类号: G06V40/1306 , B06B1/0215 , B06B1/0692 , G06F3/0433 , G06F3/0436 , B06B2201/70
摘要: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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公开(公告)号:US11950512B2
公开(公告)日:2024-04-02
申请号:US17210023
申请日:2021-03-23
申请人: Apple Inc.
发明人: Ehsan Khajeh , Aaron S. Tucker , Andrew W. Joyce , Brian M. King , Giovanni Gozzini , Jason S. Griesbach , Marcus C. Yip , Mohammad Yeke Yazdandoost , Gordon S. Franza , Henry H. Yang
CPC分类号: H10N30/878 , H10N30/10516 , H10N30/2047
摘要: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
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公开(公告)号:US11415491B2
公开(公告)日:2022-08-16
申请号:US16145054
申请日:2018-09-27
申请人: Apple Inc.
发明人: Henry H. Yang , Roberto M. Ribeiro
IPC分类号: G01N1/22 , F04B45/047 , G01N33/00
摘要: A gas-sensing apparatus with gas convection capability includes a gas sensor mounted inside a container, a substrate forming a bottom plate of the container and an actuator. The gas sensor is mounted over a first surface of the substrate internal to the container. The actuator is coupled to a second surface of the substrate external to the container. The actuator can cause convection of a gas within the container by enabling movements of the substrate in response to an activation signal.
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公开(公告)号:US09850127B1
公开(公告)日:2017-12-26
申请号:US15669231
申请日:2017-08-04
申请人: Apple Inc.
发明人: Milind S. Bhagavat , Richard Yeh , Henry H. Yang
CPC分类号: B81C1/00825 , B81B2203/0118 , B81B2207/115
摘要: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
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公开(公告)号:US09167325B2
公开(公告)日:2015-10-20
申请号:US13658316
申请日:2012-10-23
申请人: Apple Inc.
发明人: Henry H. Yang , Matthew E. Last , Romain A. Teil
CPC分类号: H04R1/021 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H01L2924/16152 , H04M2250/12 , H04R1/04 , H04R2499/11 , H01L2924/00014
摘要: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
摘要翻译: 电子设备可以设置有环境传感器。 环境传感器可以包括一个或多个环境传感器部件和一个或多个声学部件。 声学部件可以包括扬声器或麦克风。 环境传感器部件可以包括温度传感器,压力传感器,湿度传感器或用于感测设备周围环境的属性的其他传感器或传感器组合。 环境传感器可以具有带开口的外壳。 外壳可以由刚性支撑结构和印刷电路的一部分形成。 开口可以形成在刚性支撑结构或印刷电路中。 用于环境传感器的外壳中的开口可与装置的外部结构构件中的开口对准。 外部结构构件可以是用于装置显示器的壳体结构或覆盖层。
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