公开(公告)号：US09680249B2

公开(公告)日：2017-06-13

申请号：US15282768

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Peter A. Dvorak ,  Siri Amrit Ramos ,  Xuyang Zhang ,  Cesar Lozano Villarreal ,  Ciaran J. Keane ,  Alexander M. Kwan

IPC: H01R43/24 ,  H01R31/06 ,  H01R13/516 ,  H01B17/64 ,  H01R13/504 ,  H01R43/18 ,  H01R13/66

CPC classification number: H01R13/504 ,  H01R13/665 ,  H01R31/065 ,  H01R43/18

Abstract: An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.

公开(公告)号：US20170093078A1

公开(公告)日：2017-03-30

申请号：US15282768

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Peter A. Dvorak ,  Siri Amrit Ramos ,  Xuyang Zhang ,  Cesar Lozano Villarreal ,  Ciaran J. Keane ,  Alexander M. Kwan

IPC: H01R13/504 ,  H01R31/06 ,  H01R13/66 ,  H01R43/18

CPC classification number: H01R13/504 ,  H01R13/665 ,  H01R31/065 ,  H01R43/18

Abstract: An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.