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    Electronic Device Having Antenna with Vent Structures
    5.
    发明公开
    Electronic Device Having Antenna with Vent Structures 审中-公开

    公开(公告)号：US20240079785A1

    公开(公告)日：2024-03-07

    申请号：US18458811

    申请日：2023-08-30

    申请人： Apple Inc.

    发明人： Yiren Wang ,  Yuan Tao ,  Hao Xu ,  Yuancheng Xu ,  Enrique Ayala Vazquez ,  Nikolaj P. Kammersgaard ,  Eric W. Bates ,  Peter A. Dvorak ,  Victor C. Lee ,  Han Wang

    IPC分类号： H01Q9/04

    CPC分类号： H01Q9/0421 ,  H01Q1/243

    摘要： An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

    Electronic Device with Antenna Grounding Through Sensor Module
    6.
    发明公开
    Electronic Device with Antenna Grounding Through Sensor Module 审中-公开

    公开(公告)号：US20240079779A1

    公开(公告)日：2024-03-07

    申请号：US18458779

    申请日：2023-08-30

    申请人： Apple Inc.

    发明人： Yuan Tao ,  Yiren Wang ,  Ana Papio Toda ,  Jingni Zhong ,  Han Wang ,  Hao Xu ,  Hongfei Hu ,  Mattia Pascolini ,  Eric W. Bates ,  Peter A. Dvorak ,  Allegra Shum

    IPC分类号： H01Q5/328 ,  H01Q9/04

    CPC分类号： H01Q5/328 ,  H01Q9/0442

    摘要： An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.

    Power adapter housing with snaps capable of bidirectional deflection
    7.
    发明授权
    Power adapter housing with snaps capable of bidirectional deflection 有权

    公开(公告)号：US11516929B2

    公开(公告)日：2022-11-29

    申请号：US16996795

    申请日：2020-08-18

    申请人： Apple Inc.

    发明人： Peter A. Dvorak ,  Jeremy M. Dahl ,  Michael A. Foote ,  Brian K. Thorne ,  Cesar Lozano Villarreal

    IPC分类号： H05K5/00 ,  H01R13/66 ,  H01R31/06 ,  H01R13/44 ,  H05K5/02

    摘要： A power adapter is disclosed. The power adapter includes housing parts that carries electronic components. To secure the housing parts together, one housing part includes snaps and another housing part includes protrusions and rails. During assembly, the protrusions slide under the snap, causing the snap to deflect in one direction, while the rails slide over the snap, which keeps the snap partially flat but also causes the snap to deflect in another direction. The engagement (during assembly) of the rails and the protrusions to opposing surfaces of the snap cause bi-directional deflection/bending of the snap. When each protrusion is positioned into an opening of the snap, the snap returns to a flat, non-deflected state, and the housing parts are secured together by the snap, protrusions, and rails. The rails support the snaps by limiting or preventing additional deflection of the snap, which subsequently promotes the housing remaining together.