公开(公告)号：US20240314992A1

公开(公告)日：2024-09-19

申请号：US18122635

申请日：2023-03-16

Applicant: Apple Inc.

Inventor： Henry M. DAGHIGHIAN

IPC: H05K9/00

CPC classification number: H05K9/0083 ,  H05K9/006 ,  H05K9/0088

Abstract: A multilayer shield is used as an absorber for attenuating electromagnetic radiation (e.g., EMI) includes both metal and ferrite powder layers. Radiation transmitted through one of the metal layers be transmitted to an additional metal layer, and the radiation can be reflected between the metal layers. While reflected by the metal layers, the radiation is absorbed by one of the ferrite powder layers positioned between the metal layers, causing the ferrite powder layer to convert the radiation to thermal energy. Based on energy losses of the radiation due to reflection and thermal energy conversion, the radiation is sufficiently attenuated to limit disruption of nearby transmission signals, including high frequency transmission signals.

公开(公告)号：US20250098354A1

公开(公告)日：2025-03-20

申请号：US18467041

申请日：2023-09-14

Applicant: Apple Inc.

Inventor： Henry M. DAGHIGHIAN ,  Patrick Zilaro ,  Joel Weiss

IPC: H01L27/146

Abstract: The present disclosure describes an integrated circuit device that includes a ceramic-based substrate, a stack of layers disposed on the ceramic-based substrate, and electronic elements. The stack of layers includes an insulation layer and a conductive layer having conductive traces. The electronic elements are electrically connected to the conductive layer. The conductive layer is configured to route electrical signals to the electronic elements.