公开(公告)号：US12108581B2

公开(公告)日：2024-10-01

申请号：US17952183

申请日：2022-09-23

申请人： Ubicquia, Inc.

发明人： Gustavo Dario Leizerovich ,  Ivan Quiroz ,  Claudio Santiago Ribeiro ,  Cesar Eduardo Nunez ,  Steven Kenneth Mackiewicz

IPC分类号： H05K9/00 ,  H04B1/38 ,  H05K7/20

CPC分类号： H05K9/0037 ,  H04B1/38 ,  H05K9/0015 ,  H05K9/0058 ,  H05K9/006 ,  H05K7/20145

摘要： A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.

公开(公告)号：US11980010B2

公开(公告)日：2024-05-07

申请号：US17889727

申请日：2022-08-17

申请人： Google LLC

发明人： Frédéric Heckmann ,  Ihab A. Ali

IPC分类号： H05K7/20 ,  H01L23/373 ,  H05K9/00

CPC分类号： H05K7/2039 ,  H01L23/3735 ,  H05K7/20472 ,  H05K9/0033 ,  H05K9/006 ,  H05K7/20445

摘要： This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

公开(公告)号：US20230404481A1

公开(公告)日：2023-12-21

申请号：US18149980

申请日：2023-01-04

申请人： Dan Miulli ,  James Garvin Wiginton, IV ,  James Brazdzionis ,  Paras Savla

发明人： Dan Miulli ,  James Garvin Wiginton, IV ,  James Brazdzionis ,  Paras Savla

IPC分类号： A61B5/00 ,  H05K9/00 ,  A61B5/291

CPC分类号： A61B5/6803 ,  H05K9/0049 ,  H05K9/006 ,  A61B2562/227 ,  A61B2562/0209 ,  A61B2562/182 ,  A61B5/291

摘要： A device for shielding electromagnetic fields is provided. The device embodies a helmet having layers of a nickel-iron ferromagnetic alloy, a copper mesh, and an air gap; at least one channel extending radially from the helmet; at least one plug configured to removably fit into respective channels wherein each plug is operative shielding electromagnetic fields by way of the channel; and at least one sensor incorporated into the helmet.

公开(公告)号：US20230208463A1

公开(公告)日：2023-06-29

申请号：US17952228

申请日：2022-09-24

申请人： Ubicquia, Inc.

发明人： Gustavo Dario Leizerovich ,  Claudio Santiago Ribeiro ,  Cesar Eduardo Nunez ,  Fernando Ferrales

IPC分类号： H04B1/38 ,  H04B7/0413 ,  H05K7/20 ,  H05K9/00

CPC分类号： H04B1/38 ,  H04B7/0413 ,  H05K7/20136 ,  H05K9/006

摘要： A small cell access node includes a housing, a radio module, a power supply module, and one or more antennas coupled to the radio module. The housing includes a floor and at least one sidewall extending around a perimeter of the floor. An air intake section of the sidewall is located at a first lengthwise end of the floor and defines an air intake port. An air exhaust section of the sidewall is located at a second lengthwise end of the floor and defines an air exhaust port. The floor includes a two floor portions residing primarily in different planes and an angled transition portion interconnecting the two floor portions. The transition portion defines an air and water exhaust port to allow water that enters the housing through the air intake and air exhaust ports, such as from wind-driven rain, to drain out of the housing.

公开(公告)号：US20230189489A1

公开(公告)日：2023-06-15

申请号：US18080361

申请日：2022-12-13

申请人： ATEME

发明人： Jean-Michel Capitan

IPC分类号： H05K9/00 ,  H03H7/01 ,  H03H7/06 ,  H05K1/18

CPC分类号： H05K9/0022 ,  H03H7/0115 ,  H03H7/06 ,  H05K9/006 ,  H05K1/18

摘要： An electronic apparatus comprising an electronic board on which are placed an electronic subassembly and a filtering unit, the analog subassembly comprising one or more radiofrequency analog components for receiving radiofrequency components is proposed. The analog subassembly is protected by shielding placed on one side of the electronic board, the filtering unit is placed on the side of the electronic board on a signal path electrically connected to the analog subassembly, the filtering unit comprises a capacitive component placed under the shielding and connected to an analog ground, and the filtering unit further comprises a filtering component placed on the input to the filtering unit in series with the signal path on passing through the shielding or in the immediate vicinity of the shielding.

公开(公告)号：US20180249598A1

公开(公告)日：2018-08-30

申请号：US15611794

申请日：2017-06-02

申请人： Wistron Corporation

发明人： Tzu-Chieh Huang ,  Hsu-Lung Lai ,  Tsung-Ming Lee

IPC分类号： H05K9/00

CPC分类号： H05K9/006 ,  H05K9/0032 ,  H05K9/0067 ,  H05K9/0075

摘要： An assembling component includes a frame and a cover. The frame has an opening, a first plane, and a first assembling structure. The first plane surrounds and is adjacent to the opening. An area of the opening is larger than an area of the first plane. The first assembling structure is formed on the first plane. The cover covers the opening and the first plane and has a second assembling structure. A side of the cover has a second plane parallel to the first plane. The second assembling structure is formed on the second plane. An end of the second assembling structure extends from the second plane toward another side of the cover. The second assembling structure is assembled with the first assembling structure to stop the cover from moving relative to the frame.

公开(公告)号：US09918414B2

公开(公告)日：2018-03-13

申请号：US14974222

申请日：2015-12-18

申请人： INTEL CORPORATION

发明人： Robert Sankman

IPC分类号： H05K9/00 ,  H01L23/552

CPC分类号： H05K9/0007 ,  H01L23/552 ,  H01L2224/97 ,  H05K9/006 ,  H05K9/0086

摘要： Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

公开(公告)号：US09795043B2

公开(公告)日：2017-10-17

申请号：US14487283

申请日：2014-09-16

申请人： CommScope, Inc. of North Carolina

发明人： Shi Man Li ,  Chi-Min Kang ,  Jui-Huang Chung

IPC分类号： H01P5/12 ,  H05K5/00 ,  H05K9/00

CPC分类号： H05K5/0026 ,  H04Q2213/13003 ,  H05K9/0039 ,  H05K9/006

摘要： Radio frequency subscriber drop units include a housing having an input port and an output port and a printed circuit board mounted in an interior of the housing. The printed circuit board includes a dielectric layer, a wiring layer that includes conductive wirings that comprise at least part of a communications path between the input port and the output port that is on a first face of the dielectric layer, and a ground plane layer that includes a conductive ground plane that is on a second face of the dielectric layer.

公开(公告)号：US09693492B2

公开(公告)日：2017-06-27

申请号：US14111107

申请日：2012-01-31

申请人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

发明人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K9/00 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66

CPC分类号： H05K9/006 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/3025

摘要： A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element.

公开(公告)号：US20150244114A1

公开(公告)日：2015-08-27

申请号：US14711850

申请日：2015-05-14

申请人： Funai Electric Co., Ltd.

发明人： Masahiro ANDO

IPC分类号： H01R13/73

CPC分类号： H01R13/73 ,  H01R13/62938 ,  H01R13/64 ,  H01R13/74 ,  H01R23/7052 ,  H03J1/00 ,  H04N5/50 ,  H04N5/64 ,  H04N5/655 ,  H05K9/006

摘要： A tuner comprises a frame that is provided with a through-hole and a connection portion to which a connector is connected. The connection portion includes a flange portion that is able to select to pass through the through-hole or not to pass through the through-hole by the connection portion being rotated, and the frame includes a pressurization portion that pressurizes the flange portion which passes through the through-hole.

摘要翻译： 调谐器包括设置有通孔的框架和连接器所连接的连接部分。 连接部分包括能够选择通过通孔的凸缘部分或不通过旋转的连接部分通过通孔，并且框架包括对通过的凸缘部分进行加压的加压部分 通孔。