公开(公告)号：US20190021184A1

公开(公告)日：2019-01-17

申请号：US15730394

申请日：2017-10-11

Applicant: Apple Inc.

Inventor： Reuben J. WILLIAMS ,  Vinh H. DIEP ,  Jonathan MATHESON

IPC: H05K7/20 ,  F28D7/00 ,  G06F1/20 ,  H01L23/427

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.