公开(公告)号：US12181740B1

公开(公告)日：2024-12-31

申请号：US18323906

申请日：2023-05-25

Applicant: Apple Inc.

Inventor： Peng Lv ,  Mahmut Tosun ,  Ho Hyung Lee ,  Paul W Tsao ,  Da Yu ,  Michael Vosgueritchian ,  Francois R Jacob

IPC: G02F1/1333

Abstract: A transparent structure may have layers with curved cross-sectional profiles. The transparent structure may have inner and outer layers with curved portions formed by bending the layers. A display may be applied to one or more of the inner and outer layers. To reduce the strain applied to the display while being bent into a desired curvature, a carrier film may be used during bending operations. The carrier film may be modified with a patch or openings distribute the strain evenly across the display. Additionally or alternatively, a convex mold may be used to further decrease the strain on the display while being formed into the desired curvature.

公开(公告)号：US20220087534A1

公开(公告)日：2022-03-24

申请号：US17031559

申请日：2020-09-24

Applicant: Apple Inc.

Inventor： Paul Mansky ,  Xiaofan Niu ,  James C. Clements ,  Mahmut Tosun ,  Michael Vosgueritchian

IPC: A61B5/01 ,  A61B5/00

Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

公开(公告)号：US11771329B2

公开(公告)日：2023-10-03

申请号：US17031559

申请日：2020-09-24

Applicant: Apple Inc.

Inventor： Paul Mansky ,  Xiaofan Niu ,  James C. Clements ,  Mahmut Tosun ,  Michael Vosgueritchian

IPC: A61B5/01 ,  A61B5/00 ,  G01K13/20

CPC classification number: A61B5/01 ,  A61B5/6892 ,  G01K13/20 ,  A61B2562/0271 ,  A61B2562/043

Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.