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公开(公告)号：US11781919B2
公开(公告)日：2023-10-10
申请号：US17882423
申请日：2022-08-05
Applicant: Apple Inc.
Inventor： James C. Clements , Chad A. Bossetti , Habib S. Karaki , Paul Mansky
Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.
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公开(公告)号：US11771329B2
公开(公告)日：2023-10-03
申请号：US17031559
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Paul Mansky , Xiaofan Niu , James C. Clements , Mahmut Tosun , Michael Vosgueritchian
CPC classification number: A61B5/01 , A61B5/6892 , G01K13/20 , A61B2562/0271 , A61B2562/043
Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.
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Patent Agency Ranking
公开(公告)号：US20220373404A1
公开(公告)日：2022-11-24
申请号：US17882423
申请日：2022-08-05
Applicant: Apple Inc.
Inventor： James C. Clements , Chad A. Bossetti , Habib S. Karaki , Paul Mansky
Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.
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公开(公告)号：US20220026284A1
公开(公告)日：2022-01-27
申请号：US16935046
申请日：2020-07-21
Applicant: Apple Inc
Inventor： James C. Clements , Chad A. Bossetti , Habib S. Karaki , Paul Mansky
Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.
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公开(公告)号：US11408778B2
公开(公告)日：2022-08-09
申请号：US16935046
申请日：2020-07-21
Applicant: Apple Inc.
Inventor： James C. Clements , Chad A. Bossetti , Habib S. Karaki , Paul Mansky
Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.
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公开(公告)号：US20240074665A1
公开(公告)日：2024-03-07
申请号：US18147628
申请日：2022-12-28
Applicant: Apple Inc.
Inventor： Daniel J. Hiemstra , Jeffrey W. Buchholz , Xiaofan Niu , James C. Clements , Wei Lin , Habib S. Karaki , Paul Mansky , Boyi Fu , Yanfeng Chen , Edmilson Besseler
CPC classification number: A61B5/01 , A61B5/681 , A61B5/7203 , A61B5/7246 , G01K13/20 , A61B2562/0271 , A61B2562/12
Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.
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公开(公告)号：US20220087534A1
公开(公告)日：2022-03-24
申请号：US17031559
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Paul Mansky , Xiaofan Niu , James C. Clements , Mahmut Tosun , Michael Vosgueritchian
Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.
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