公开(公告)号：US10701845B2

公开(公告)日：2020-06-30

申请号：US16262763

申请日：2019-01-30

Applicant: Apple Inc.

Inventor： Griffin L. Schmitt ,  Benjamin S. Bustle ,  Kevin M. Froese ,  Lucy E. Browning ,  Zhipeng Zhang ,  Jaden A. Barney ,  Nan Li

IPC: H05K9/00 ,  H05K5/00 ,  H05K5/03 ,  H05K5/02

Abstract: A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.