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公开(公告)号：US20250105862A1
公开(公告)日：2025-03-27
申请号：US18807791
申请日：2024-08-16
Applicant: Apple Inc.
Inventor： Bradley D. Scoles , Qishan Yu , Christopher J. Huber
Abstract: An electronic device may include a radio-frequency front end (RFFE) module coupled to antenna(s). The module may have a power amplifier, a transmit switch, a receive switch, low noise amplifiers, and an antenna switch. The transmit switch may be coupled to the antenna switch over transmit paths. The antenna switch may be coupled to the low noise amplifiers over receive paths. Filters on different transmit paths may have passbands overlapping the transmit bands of respective first and second frequency bands. A filter on the receive path may have a passband overlapping the receive bands of the first and second frequency bands. The antenna switch may have multiple throws for concurrently coupling one of the transmit paths and one of the receive paths to the antenna(s). Combining filters and switching in this way may minimize the number of low noise amplifiers and filters on the module without sacrificing performance.
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公开(公告)号：US12068533B2
公开(公告)日：2024-08-20
申请号：US17087029
申请日：2020-11-02
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Samia El Amrani , Qishan Yu
CPC classification number: H01Q1/38 , H01Q1/2283 , H04B1/0458 , H04B1/1607 , H04B17/101
Abstract: Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10826169B2
公开(公告)日：2020-11-03
申请号：US16368535
申请日：2019-03-28
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Samia El Amrani , Qishan Yu
Abstract: Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10763899B1
公开(公告)日：2020-09-01
申请号：US16584176
申请日：2019-09-26
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Qishan Yu , Samia El Amrani
Abstract: Systems and methods for driving using a radio-frequency integrated circuit to drive one or more front end modules. The front end modules provide signal flexibility to an electronic device. The radio-frequency integrated circuit drives the one or more front end modules via dual-pole, dual-throw switches that enable a pair of radio-frequency chains in the radio-frequency integrated circuit to drive two pairs of radio-frequency chains in each of two connected front end modules.
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公开(公告)号：US20200220255A1
公开(公告)日：2020-07-09
申请号：US16368525
申请日：2019-03-28
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Samia El Amrani , Qishan Yu
Abstract: Techniques for implementing and/or operating a radio frequency system, which includes a logic board having a transceiver integrated circuit and a remote head coupled to the logic board via a one or more electrical connectors. The remote head includes an antenna circuit board having a pad, an antenna formed on a surface of the antenna circuit board opposite the pad, and a remote head system-in-package. The remote head system-in-package includes a system-in-package circuit board having a pin that interfaces with the pad on the antenna circuit board and an integrated circuit device coupled to a surface of the system-in-package circuit board opposite the pin, in which the integrated circuit device includes one or more amplifier units that each amplifies a corresponding analog electrical signal communicated with the antenna.
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Patent Agency Ranking
公开(公告)号：US20250096821A1
公开(公告)日：2025-03-20
申请号：US18745278
申请日：2024-06-17
Applicant: Apple Inc.
Inventor： Bradley D. Scoles , Qishan Yu , Christopher J. Huber
Abstract: In an electronic device, a transmitter and a receiver may each be coupled to one or more antennas to enable the electronic device to both transmit and receive wireless signals. The electronic device may include two or more antennas coupled to a radio frequency front end module that receives different downlink signals on different frequency bands. For example, a switch may couple a first antenna to a first duplexer to support transmitting and/or receiving signals within a first frequency band and a second antenna to a second duplexer to support transmitting and/or receiving signals within a second frequency band. As such, the electronic device may concurrently transmit and/or receive two signals having different frequencies, which may improve downlink throughput and/or support downlink carrier aggregation.
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公开(公告)号：US20240364282A1
公开(公告)日：2024-10-31
申请号：US18308505
申请日：2023-04-27
Applicant: Apple Inc.
Inventor： Bradley D. Scoles , Qishan Yu , Christopher J. Huber
IPC: H03F3/24
CPC classification number: H03F3/245 , H03F2200/102 , H03F2200/451
Abstract: An electronic device can include a first group of radio-frequency amplifiers coupled to one or more first antenna(s) disposed at a first end of the device, a second group of radio-frequency amplifiers coupled to one or more second antenna(s) disposed at a second opposing end of the device, a first envelope tracking integrated circuit (ETIC) coupled to the first group of radio-frequency amplifiers, and a second envelope tracking integrated circuit (ETIC) coupled to the second group of radio-frequency amplifiers. The first and second ETICs can be coupled together via a bidirectional input-output voltage path and a feedback voltage path. At least the first ETIC can include a first envelope tracking amplifier, a second envelope tracking amplifier, a voltage converter coupled to an output of the first envelope tracking amplifier, and a feedback controller coupled to an output of the second envelope tracking amplifier and configured to adjust the voltage converter.
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公开(公告)号：US20240363999A1
公开(公告)日：2024-10-31
申请号：US18767315
申请日：2024-07-09
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Samia El Amrani , Qishan Yu
CPC classification number: H01Q1/38 , H01Q1/2283 , H04B1/0458 , H04B1/1607 , H04B17/101
Abstract: Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10826168B2
公开(公告)日：2020-11-03
申请号：US16368525
申请日：2019-03-28
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Samia El Amrani , Qishan Yu
Abstract: Techniques for implementing and/or operating a radio frequency system, which includes a logic board having a transceiver integrated circuit and a remote head coupled to the logic board via a one or more electrical connectors. The remote head includes an antenna circuit board having a pad, an antenna formed on a surface of the antenna circuit board opposite the pad, and a remote head system-in-package. The remote head system-in-package includes a system-in-package circuit board having a pin that interfaces with the pad on the antenna circuit board and an integrated circuit device coupled to a surface of the system-in-package circuit board opposite the pin, in which the integrated circuit device includes one or more amplifier units that each amplifies a corresponding analog electrical signal communicated with the antenna.
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公开(公告)号：US10469120B1
公开(公告)日：2019-11-05
申请号：US16145614
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Berke Cetinoneri , Ioannis Sarkas , Qishan Yu
Abstract: Systems and methods for improving communication reliability of a radio frequency system that includes an antenna integrated circuit, which includes an antenna amplifier unit that outputs a first analog electrical signal that indicates data, a transceiver integrated circuit implemented using a first semiconductor manufacturing technique, in which the transceiver integrated circuit includes a transceiver amplifier unit that outputs a second analog electrical signal that indicates the data, and a driver integrated circuit implemented using a second semiconductor manufacturing technique. The driver integrated circuit includes an intermediate amplifier unit, which outputs a third analog electrical signal that indicates the data, and intermediate routing circuitry, which routes the first analog electrical signal to the intermediate amplifier unit and the third analog electrical signal to the transceiver integrated circuit during reception and routes the second analog electrical signal to the intermediate amplifier unit and the third analog electrical to the antenna integrated circuit during transmission.
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