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公开(公告)号：US20200220256A1
公开(公告)日：2020-07-09
申请号：US16368535
申请日：2019-03-28
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US20210050658A1
公开(公告)日：2021-02-18
申请号：US17087029
申请日：2020-11-02
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US20240363999A1
公开(公告)日：2024-10-31
申请号：US18767315
申请日：2024-07-09
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
CPC分类号： H01Q1/38 , H01Q1/2283 , H04B1/0458 , H04B1/1607 , H04B17/101
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10826168B2
公开(公告)日：2020-11-03
申请号：US16368525
申请日：2019-03-28
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board having a transceiver integrated circuit and a remote head coupled to the logic board via a one or more electrical connectors. The remote head includes an antenna circuit board having a pad, an antenna formed on a surface of the antenna circuit board opposite the pad, and a remote head system-in-package. The remote head system-in-package includes a system-in-package circuit board having a pin that interfaces with the pad on the antenna circuit board and an integrated circuit device coupled to a surface of the system-in-package circuit board opposite the pin, in which the integrated circuit device includes one or more amplifier units that each amplifies a corresponding analog electrical signal communicated with the antenna.
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公开(公告)号：US12068533B2
公开(公告)日：2024-08-20
申请号：US17087029
申请日：2020-11-02
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
CPC分类号： H01Q1/38 , H01Q1/2283 , H04B1/0458 , H04B1/1607 , H04B17/101
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10826169B2
公开(公告)日：2020-11-03
申请号：US16368535
申请日：2019-03-28
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board that outputs an analog electrical signal indicative of data to be wirelessly transmitted from the radio frequency system and a remote head. The remote head includes an antenna that generates an electromagnetic wave to facilitate wirelessly transmitting the data, an antenna integrated circuit implemented using a first semiconductor manufacturing technique, in which the antenna integrated circuit amplifies the analog electrical signal to generate a first amplified analog electrical signal, and a remote front-end integrated circuit coupled between the antenna integrated circuit and the antenna. The remote front-end integrated circuit is implemented using a second semiconductor manufacturing technique different from the first semiconductor manufacturing technique and amplifies the first amplified analog electrical signal based on a target output power of the antenna to generate a second amplified analog electrical signal indicative of the data.
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公开(公告)号：US10763899B1
公开(公告)日：2020-09-01
申请号：US16584176
申请日：2019-09-26
申请人： Apple Inc.
发明人： Berke Cetinoneri , Qishan Yu , Samia El Amrani
摘要： Systems and methods for driving using a radio-frequency integrated circuit to drive one or more front end modules. The front end modules provide signal flexibility to an electronic device. The radio-frequency integrated circuit drives the one or more front end modules via dual-pole, dual-throw switches that enable a pair of radio-frequency chains in the radio-frequency integrated circuit to drive two pairs of radio-frequency chains in each of two connected front end modules.
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公开(公告)号：US20200220255A1
公开(公告)日：2020-07-09
申请号：US16368525
申请日：2019-03-28
申请人： Apple Inc.
发明人： Berke Cetinoneri , Samia El Amrani , Qishan Yu
摘要： Techniques for implementing and/or operating a radio frequency system, which includes a logic board having a transceiver integrated circuit and a remote head coupled to the logic board via a one or more electrical connectors. The remote head includes an antenna circuit board having a pad, an antenna formed on a surface of the antenna circuit board opposite the pad, and a remote head system-in-package. The remote head system-in-package includes a system-in-package circuit board having a pin that interfaces with the pad on the antenna circuit board and an integrated circuit device coupled to a surface of the system-in-package circuit board opposite the pin, in which the integrated circuit device includes one or more amplifier units that each amplifies a corresponding analog electrical signal communicated with the antenna.
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