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公开(公告)号：US10148000B2
公开(公告)日：2018-12-04
申请号：US15233891
申请日：2016-08-10
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US20230198129A1
公开(公告)日：2023-06-22
申请号：US18109168
申请日：2023-02-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , H04M1/0283 , H04M1/0249 , G06F1/1656 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , B29L2031/34
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11581629B2
公开(公告)日：2023-02-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US12074363B2
公开(公告)日：2024-08-27
申请号：US18109168
申请日：2023-02-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , G06F1/1656 , H04M1/0249 , H04M1/0283 , B29C37/0082 , B29L2031/34 , B29L2031/3437 , G06F2200/1633
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US10559872B2
公开(公告)日：2020-02-11
申请号：US16147703
申请日：2018-09-29
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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Patent Agency Ranking
公开(公告)号：US20170069956A1
公开(公告)日：2017-03-09
申请号：US15233891
申请日：2016-08-10
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C37/0082 , B29C45/14311 , B29C45/14467 , B29L2031/34 , B29L2031/3437 , G06F1/1626 , G06F1/1633 , G06F1/1656 , G06F2200/1633 , H04M1/0249 , H04M1/0283
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括第一部件和第二部件，第一部件和第二部件通过间隙与第一部件分离。 壳体还包括第一模制元件，其至少部分地设置在间隙内并且限定互锁特征的至少一部分，以及至少部分地设置在间隙内并机械地接合互锁特征的第二模制元件。 第一部件，第二部件和第二模制部件形成壳体的外表面的一部分。 还公开了一种形成壳体的方法。
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公开(公告)号：US20240372245A1
公开(公告)日：2024-11-07
申请号：US18772078
申请日：2024-07-12
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US20220115770A1
公开(公告)日：2022-04-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11223105B2
公开(公告)日：2022-01-11
申请号：US16740753
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US20200153088A1
公开(公告)日：2020-05-14
申请号：US16740753
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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