Electronic device case and manufacturing method therefor

    公开(公告)号:US11812572B2

    公开(公告)日:2023-11-07

    申请号:US17257911

    申请日:2019-07-04

    Inventor: Hyunsoo Kim

    CPC classification number: H05K5/0243 B23B27/20 G06F1/1633

    Abstract: Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.

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