INDUCTION ACTIVATED THERMAL BONDING
    2.
    发明申请
    INDUCTION ACTIVATED THERMAL BONDING 有权
    感应激活热连接

    公开(公告)号:US20140117006A1

    公开(公告)日:2014-05-01

    申请号:US13889225

    申请日:2013-05-07

    Applicant: APPLE INC.

    CPC classification number: H05B6/105 H05B6/14

    Abstract: The described embodiment relates generally to the field of inductive heating. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a radio-frequency (RF) receiver structure are disclosed for the purpose of completing an inductive bonding process without causing harm to adjacent electrical components.

    Abstract translation: 所描述的实施例大体上涉及感应加热领域。 更具体地,公开了一种设计用于组装电子设备的感应加热器。 公开了一种用于成形射频(RF)接收机结构的方法,用于完成感应接合过程而不会对相邻的电气部件造成伤害。

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