公开(公告)号：US20240322327A1

公开(公告)日：2024-09-26

申请号：US18284370

申请日：2022-12-01

申请人： EVE POWER CO., LTD.

发明人： Chaoju REN ,  Jungao LU ,  Guojiang ZHANG ,  Yuhong XU ,  Jibing JIANG

IPC分类号： H01M50/242 ,  H01M50/213 ,  H01M50/262 ,  H01M50/284 ,  H01M50/289 ,  H01M50/505 ,  H01M50/514 ,  H01M50/519 ,  H05K1/02

CPC分类号： H01M50/242 ,  H01M50/213 ,  H01M50/262 ,  H01M50/284 ,  H01M50/289 ,  H01M50/505 ,  H01M50/514 ,  H01M50/519 ,  H05K1/0281

摘要： The present application discloses a battery module, including: a mounting bracket including a first mounting surface and a second mounting surface disposed opposite to each other, where the first mounting surface is provided with a plurality of fixing plates; a busbar assembly detachably connected to the mounting bracket and disposed on the second mounting surface; a plurality of cells arranged on the first mounting surface and connected to the bus bar assembly; an FPC board assembly including a plurality of FPC boards and a plurality of connectors, where the FPC boards are vertically disposed on the first mounting surface, a connection end of each of the FPC boards is fixedly connected to respective one of the connectors and riveted to respective one of the fixing boards.

公开(公告)号：US20240105758A1

公开(公告)日：2024-03-28

申请号：US17754825

申请日：2020-10-22

申请人： SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： HIIZU OHTORII ,  HIROSHI MORITA ,  YUSUKE OYAMA ,  EIJI OTANI ,  KEN KIKUCHI

IPC分类号： H01L27/15 ,  H01L33/58 ,  H01L33/64 ,  H05K1/02

CPC分类号： H01L27/156 ,  H01L33/58 ,  H01L33/64 ,  H05K1/0281

摘要： The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.

公开(公告)号：US20240080540A1

公开(公告)日：2024-03-07

申请号：US18307539

申请日：2023-04-26

申请人： LG INNOTEK CO., LTD.

发明人： Jong Ho Chung ,  Sung Il Lee

IPC分类号： H04N23/55 ,  G02B7/00 ,  G02B7/08 ,  G02B7/09 ,  G02B27/64 ,  H04N23/54 ,  H05K3/30

CPC分类号： H04N23/55 ,  G02B7/006 ,  G02B7/08 ,  G02B7/09 ,  G02B27/646 ,  H04N23/54 ,  H05K3/305 ,  H05K1/0281

摘要： A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel that is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device that comprises a terminal and moves the lens barrel in the first direction; a first circuit board that is disposed under the first holder and on which an image sensor is mounted; a soldering portion for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement portion that is disposed to face the soldering portion and couples the lens operating device and the first circuit board.

公开(公告)号：US20230395878A1

公开(公告)日：2023-12-07

申请号：US18186868

申请日：2023-03-20

申请人： NIPPON MEKTRON, LTD.

发明人： Katsuhito SHIROTA ,  Tomoki KANAYAMA ,  Shuzo YAMADA

IPC分类号： H01M10/42 ,  H05K1/02 ,  H05K1/03

CPC分类号： H01M10/425 ,  H05K1/0281 ,  H05K1/0393

摘要： Provided is a flexible printed wiring board attached to a battery, including: multiple lines are provided only on one surface of the flexible printed wiring board, one end of a first line group and a second line group are respectively connected to one of multiple terminals of the battery, and the other end of the first line group is arranged in a bent portion, and the other end of the second line group and one end of a third line group are arranged at an end portion of a trunk portion, and the other end of the third line group is arranged in the trunk portion, and the bent portion is bent such that the other end of the first line group arranged in the bent portion and the other end of the third line group arranged in the trunk portion are connected to each other.

公开(公告)号：US11839018B2

公开(公告)日：2023-12-05

申请号：US17427110

申请日：2020-12-17

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Wenxiao Niu ,  Xinpeng Wang ,  Hengzhen Liang ,  Xiaolong Zhu ,  Lianbin Liu

IPC分类号： H05K1/18 ,  H05K1/02 ,  G06F3/041 ,  G06F3/044 ,  H10K59/40 ,  H10K59/131

CPC分类号： H05K1/0218 ,  G06F3/04164 ,  H05K1/0281 ,  H05K1/189 ,  G06F3/0412 ,  G06F3/0446 ,  H05K2201/0715 ,  H05K2201/09027 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09509 ,  H05K2201/10128 ,  H05K2201/10189 ,  H05K2201/2009 ,  H10K59/131 ,  H10K59/40

摘要： A flexible printed circuit board and a display touch apparatus are provided. The flexible printed circuit board includes a binding terminal region, a first circuit region and a second circuit region; the binding terminal region includes multiple terminals, the first circuit region includes a driver circuit, multiple first signal lines, multiple second signal lines, and multiple third signal lines, and the second circuit region includes an external connector; first ends of the multiple first signal lines, the multiple second signal lines and the multiple third signal lines are respectively connected to the terminals of the binding terminal region; second ends of the multiple first signal lines and the multiple second signal lines are respectively connected to the driver circuit; and second ends of the multiple third signal lines are connected to the connector.

公开(公告)号：US20230301165A1

公开(公告)日：2023-09-21

申请号：US18201706

申请日：2023-05-24

申请人： Samsung Display Co., Ltd.

发明人： Chang Han LEE ,  Myung Hwan KIM ,  Sang Yeol KIM ,  Woo Hyun KIM ,  Hyo Jin KIM ,  Kyoung ll MIN ,  Tae Hyun HUNG ,  Se Joong SHIN ,  Ho Ryun CHUNG ,  Jae cheol CHOI

IPC分类号： H10K77/10 ,  B32B7/022 ,  B32B3/30 ,  B32B27/08 ,  B32B27/28 ,  B32B27/36 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H04M1/02 ,  H10K50/844 ,  H10K59/131

CPC分类号： H10K77/111 ,  B32B7/022 ,  B32B3/30 ,  B32B27/08 ,  B32B27/281 ,  B32B27/36 ,  H05K1/0281 ,  H05K1/147 ,  G06F1/1652 ,  H04M1/0268 ,  H10K50/844 ,  H10K59/131 ,  B32B2457/206 ,  H05K2201/055 ,  H05K2201/10128 ,  H10K2102/311

摘要： A display device includes a display panel, a support film, and a polymer layer. The display panel includes a display area comprising a first area that is bendable, and a non-display area adjacent to the display area. The support film is coupled to a bottom surface of the display panel. The support film includes a first groove overlapping with the first area. The polymer layer is disposed in the first groove. The polymer layer includes a material with higher flexibility than the support film. Angles formed by the top surface of the support film and inner sides of the support film defining the first groove are acute angles.

公开(公告)号：US11758650B2

公开(公告)日：2023-09-12

申请号：US17246271

申请日：2021-04-30

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Dae Jung Byun ,  Jung Soo Kim ,  Sang Hyun Sim ,  Chang Min Ha ,  Jin Won Lee

IPC分类号： H05K1/18 ,  H05K1/02 ,  G06F1/16

CPC分类号： H05K1/0281 ,  G06F1/1652 ,  H05K1/189 ,  H05K2201/10128

摘要： A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

公开(公告)号：US20230269883A1

公开(公告)日：2023-08-24

申请号：US18112026

申请日：2023-02-21

申请人： UNIJET CO., LTD.

发明人： Gil Hwan YEO

IPC分类号： H05K3/12 ,  H05K5/00 ,  H05K1/02 ,  B41J2/045 ,  B41J29/02 ,  B41J25/00

CPC分类号： H05K3/125 ,  B41J2/04586 ,  B41J25/001 ,  B41J29/02 ,  H05K1/0281 ,  H05K3/1283 ,  H05K5/0018 ,  B41J2202/03

摘要： In a method for manufacturing a display panel according to an embodiment, a first anisotropic conductive layer is formed by ejecting a first anisotropic conductive layer forming material in order to bond the circuit board to the display panel, a reinforced curing layer is formed by ejecting a reinforced curing layer forming material onto a side surface of the first anisotropic conductive layer, a second anisotropic conductive layer is formed by ejecting a second anisotropic conductive layer forming material to an inner side of the second anisotropic conductive layer and the reinforced curing layer in order to bond the display drive integrated circuit, and a pixel is formed by ejecting a material for pixel printing to an inner side of the second anisotropic conductive layer for fixing the display drive integrated circuit.

公开(公告)号：US20230261333A1

公开(公告)日：2023-08-17

申请号：US18014250

申请日：2021-07-02

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Naoki FUKUSHIMA ,  Osamu NAKAYAMA ,  Katsushi MIYAZAKI ,  Mitsutoshi MORITA

IPC分类号： H01M50/519 ,  H05K1/18 ,  H05K1/02 ,  H01M50/298 ,  H01M50/516

CPC分类号： H01M50/519 ,  H05K1/189 ,  H05K1/0281 ,  H01M50/298 ,  H01M50/516 ,  H05K2201/10189 ,  H01R12/65

摘要： A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.

公开(公告)号：US11698695B2

公开(公告)日：2023-07-11

申请号：US16767577

申请日：2019-06-27

申请人： CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Xuerui Gong ,  Jiangsheng Wang ,  Yong Yu ,  Chang Zhang

IPC分类号： G06F3/041 ,  G06F3/044 ,  H05K1/02 ,  H05K1/11

CPC分类号： G06F3/04164 ,  G06F3/044 ,  H05K1/0281 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/10128

摘要： The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.