公开(公告)号：US20210382525A1

公开(公告)日：2021-12-09

申请号：US17403206

申请日：2021-08-16

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  H05K5/02 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US11099609B2

公开(公告)日：2021-08-24

申请号：US16439163

申请日：2019-06-12

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H05K5/02 ,  H05K5/03

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US20180120904A1

公开(公告)日：2018-05-03

申请号：US15829372

申请日：2017-12-01

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Mattew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H05K5/03 ,  H05K5/02 ,  H04M1/02 ,  H01Q1/24 ,  H01Q1/22

CPC classification number: G06F1/1656 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/1684 ,  G06F1/1698 ,  H01Q1/2258 ,  H01Q1/241 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0274 ,  H05K5/02 ,  H05K5/0208 ,  H05K5/03 ,  Y10T29/49002 ,  Y10T29/49169

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US20250103103A1

公开(公告)日：2025-03-27

申请号：US18974378

申请日：2024-12-09

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H05K5/02 ,  H05K5/03

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US12174673B2

公开(公告)日：2024-12-24

申请号：US17403206

申请日：2021-08-16

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H05K5/02 ,  H05K5/03

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US20180132372A1

公开(公告)日：2018-05-10

申请号：US15863706

申请日：2018-01-05

Applicant: Apple Inc.

Inventor： David Pakula ,  Scott Myers ,  Tang Tan ,  Richard Dinh

IPC: H05K5/03 ,  H04M1/02 ,  G06F1/16 ,  B65D51/00 ,  B65D45/16 ,  B65D17/28

CPC classification number: H05K5/03 ,  B65D17/4014 ,  B65D17/50 ,  B65D45/16 ,  B65D51/00 ,  G06F1/1626 ,  H04M1/0249 ,  H04M1/0252 ,  H04M1/026 ,  H04M1/0277 ,  Y10T29/49826

Abstract: This is directed to systems and methods for cover assembly retention of a portable electronic device. In some embodiments, a cover assembly and/or housing of an electronic device can include one or more retention features such as detents, hooks, tabs, extensions, screw plates, screw holes, shuttles, latches, or any combination of the above, for retaining the cover assembly to the housing. In some embodiments, one or more retention features can be included on an internal platform of the electronic device to retain the cover assembly. In some embodiments, a hidden screw feature can be included in a SIM tray slot of the electronic device. Once a SIM tray has been inserted into the SIM tray slot, the screw feature can be hidden from sight and may become unapparent to an end user of the electronic device.

公开(公告)号：US10234906B2

公开(公告)日：2019-03-19

申请号：US15829372

申请日：2017-12-01

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H05K5/03 ,  H05K5/02 ,  H04M1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US10791644B2

公开(公告)日：2020-09-29

申请号：US15863706

申请日：2018-01-05

Applicant: Apple Inc.

Inventor： David Pakula ,  Scott Myers ,  Tang Tan ,  Richard Dinh

IPC: H05K5/03 ,  H04M1/02 ,  G06F1/16 ,  B65D45/16 ,  B65D51/00 ,  B65D17/28 ,  B65D17/50

Abstract: This is directed to systems and methods for cover assembly retention of a portable electronic device. In some embodiments, a cover assembly and/or housing of an electronic device can include one or more retention features such as detents, hooks, tabs, extensions, screw plates, screw holes, shuttles, latches, or any combination of the above, for retaining the cover assembly to the housing. In some embodiments, one or more retention features can be included on an internal platform of the electronic device to retain the cover assembly. In some embodiments, a hidden screw feature can be included in a SIM tray slot of the electronic device. Once a SIM tray has been inserted into the SIM tray slot, the screw feature can be hidden from sight and may become unapparent to an end user of the electronic device.

公开(公告)号：US20190294215A1

公开(公告)日：2019-09-26

申请号：US16439163

申请日：2019-06-12

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H05K5/02 ,  H01Q1/42 ,  H05K5/03 ,  H04M1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US10353436B2

公开(公告)日：2019-07-16

申请号：US15134621

申请日：2016-04-21

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: H04M1/02 ,  H05K5/02 ,  G06F1/16 ,  H05K5/03 ,  H01Q1/22 ,  H01Q1/24

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.