Electronic Devices With Flexible Displays

    公开(公告)号:US20220077352A1

    公开(公告)日:2022-03-10

    申请号:US17390504

    申请日:2021-07-30

    Applicant: Apple Inc.

    Abstract: A foldable electronic device may have a foldable housing. The foldable housing may be configured to bend about a bend axis. First and second portions of the housing that rotate relative to each other may be coupled by a hinge that is aligned with the bend axis. A foldable display may be coupled to the foldable housing and may be configured to bend along the bend axis as the foldable housing is folded. The display may have an array of pixels supported by a metal layer. The pixels may be interposed between a display cover layer and the metal layer. The foldable housing may have a support layer. To help support the display for bending about the bend axis while preventing damage to the display when the display is contacted by an external object, a spring layer may be interposed between the metal layer and the support layer.

    Electronic devices with flexible displays

    公开(公告)号:US11961946B2

    公开(公告)日:2024-04-16

    申请号:US17390504

    申请日:2021-07-30

    Applicant: Apple Inc.

    CPC classification number: H01L33/483 H05K1/028 H05K2201/10272

    Abstract: A foldable electronic device may have a foldable housing. The foldable housing may be configured to bend about a bend axis. First and second portions of the housing that rotate relative to each other may be coupled by a hinge that is aligned with the bend axis. A foldable display may be coupled to the foldable housing and may be configured to bend along the bend axis as the foldable housing is folded. The display may have an array of pixels supported by a metal layer. The pixels may be interposed between a display cover layer and the metal layer. The foldable housing may have a support layer. To help support the display for bending about the bend axis while preventing damage to the display when the display is contacted by an external object, a spring layer may be interposed between the metal layer and the support layer.

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