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公开(公告)号:US20190191549A1
公开(公告)日:2019-06-20
申请号:US16306961
申请日:2017-06-06
申请人: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人: Yuuichi HATTORI
CPC分类号: H05K1/0263 , H01R12/718 , H02G3/14 , H02G3/16 , H05K7/06 , H05K2201/10272
摘要: A board unit including: a circuit assembly including a circuit board and a bus bar disposed on one side of the circuit board; a frame-like case that forms a housing space for housing the circuit board, and the bus bar includes: a main body to which the circuit board is joined; a plurality of facing portions that protrude from opposite sides of the main body, and that face a surface of the frame-like case, the facing portions and the frame-like case include a locking structure for interlocking the facing portions and the frame-like case with each other to hold the circuit assembly at the predetermined position in the frame-like case.
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公开(公告)号:US20190135207A1
公开(公告)日:2019-05-09
申请号:US16096131
申请日:2017-05-01
申请人: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人: Tatsuya SUMIDA
CPC分类号: B60R16/033 , B60K6/28 , B60L50/50 , B60Y2200/91 , B60Y2200/92 , B60Y2400/11 , H01G2/04 , H01G11/10 , H01G11/76 , H01G11/82 , H01G11/84 , H01R25/162 , H05K1/184 , H05K2201/10015 , H05K2201/10272
摘要: A power supply device that includes a plurality of electricity storage elements each including lead terminals; a conductive connector connected to the lead terminals; a circuit board including a conductive path; a conductive relay terminal electrically connected to the conductive path, the connector being disposed so as to be in contact with the relay terminal; and a resin holder configured to hold the plurality of electricity storage elements, wherein the holder includes an electricity storage element holder configured to hold the electricity storage elements, a connecting member holder configured to hold the connector, and a fitting groove into which the lead terminals can be fitted, and the connecting member holder is formed so as to traverse the fitting groove.
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公开(公告)号:US20190045635A1
公开(公告)日:2019-02-07
申请号:US15759604
申请日:2016-08-30
申请人: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMOT WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人: Tou Chin , Arinobu NAKAMURA
CPC分类号: H05K1/186 , H02G3/03 , H02G3/16 , H05K1/0203 , H05K3/3452 , H05K3/3494 , H05K7/1432 , H05K2201/066 , H05K2201/10166 , H05K2201/10272 , H05K2201/10409
摘要: A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.
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公开(公告)号:US20180310366A1
公开(公告)日:2018-10-25
申请号:US15767745
申请日:2016-09-01
申请人: EXATEC, LLC
CPC分类号: H05B3/84 , B41M1/12 , B41M1/30 , B41M1/34 , B41M5/0023 , B41M5/0047 , B41M5/0064 , C09D11/037 , C09D11/322 , C09D11/52 , H01B1/22 , H05K1/0212 , H05K1/0284 , H05K1/092 , H05K3/1216 , H05K3/1233 , H05K3/125 , H05K3/1283 , H05K2201/09018 , H05K2201/10098 , H05K2201/10272 , H05K2203/013 , H05K2203/0139
摘要: In an embodiment, a printing method for forming a conductive line on a plastic substrate for use in an automobile, comprises one or both of inkjet printing and screen printing the conductive line on the plastic substrate while the plastic substrate is fixed in a fixture of an automatic printing machine; the conductive mixture comprises a conductive paste; a solvent; and an adhesion agent; and wherein the conductive line is a busbar, a grid line, or an antenna line in the automobile.
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公开(公告)号:US20180278034A1
公开(公告)日:2018-09-27
申请号:US15763513
申请日:2016-09-09
申请人: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人: Tou Chin , Arinobu Nakamura
CPC分类号: H02G3/16 , B60R16/0238 , H02G3/03 , H02G3/081 , H05K1/115 , H05K1/144 , H05K1/183 , H05K7/02 , H05K2201/041 , H05K2201/066 , H05K2201/10166 , H05K2201/10272 , H05K2201/10409
摘要: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.
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公开(公告)号:US10070514B2
公开(公告)日:2018-09-04
申请号:US15339037
申请日:2016-10-31
发明人: Wolfgang Ullermann , Peter Meckler , Manuel Engewald , Matthias Schwarz , Ewald Schneider , Markus Miklis
CPC分类号: H05K1/0263 , F02N11/087 , F02N2011/0874 , H01H45/00 , H01L24/48 , H01L25/072 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H02M7/00 , H05K3/3421 , H05K2201/0382 , H05K2201/09054 , H05K2201/09063 , H05K2201/10166 , H05K2201/10272 , H05K2201/10553 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , H01L2924/00
摘要: A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.
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公开(公告)号:US20180175593A1
公开(公告)日:2018-06-21
申请号:US15724355
申请日:2017-10-04
申请人: Eaton Corporation
发明人: James Gerard Maloney
CPC分类号: H02B1/21 , F28F21/04 , F28F21/084 , F28F21/085 , H01H1/38 , H01H2071/006 , H02B1/056 , H02B1/06 , H02B1/56 , H02G3/14 , H05K1/0263 , H05K2201/10272
摘要: Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive inner member with longitudinally opposing first and second ends and an open center channel and an outer member surrounding the at least one thermally conductive inner member. The outer member is sufficiently flexible to expand outward in response to an outward force applied by the at least one thermally conductive inner member. The at least one inner member can be a plurality of cooperating inner members that have inner surfaces that align to form an inner perimeter surrounding the open center channel.
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公开(公告)号:US09954293B2
公开(公告)日:2018-04-24
申请号:US14996855
申请日:2016-01-15
发明人: Ji-Peng Xu , Guang-Zhao Tian , Yang-Qiu Lai , Xiang-Biao Sha
CPC分类号: H01R12/7047 , H01R12/7088 , H01R12/712 , H05K1/0263 , H05K3/325 , H05K2201/09063 , H05K2201/10272 , H05K2201/1031 , H05K2201/10409 , H05K2201/10962 , H05K2203/167 , Y02P70/611
摘要: A circuit board assembly includes a circuit board, at least one metal sheet, at least one bus and at least one fixed member. The circuit board has at least one electrical connecting area. The metal sheet is adapted to solder to the electrical connecting area and has at least one metal sheet hole. The bus has a connecting portion. The connecting portion is corresponding to the metal sheet. The bus has at least one fixed screwing hole. The fixed screwing hole is corresponding to the metal sheet hole. The circuit board and the bus is locked by the fixed member.
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公开(公告)号:US20180027646A1
公开(公告)日:2018-01-25
申请号:US15542783
申请日:2015-12-28
申请人: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人: Tatsuya Sumida
CPC分类号: H05K1/0204 , H05K1/0209 , H05K3/0064 , H05K3/10 , H05K3/202 , H05K3/4007 , H05K7/1432 , H05K7/20854 , H05K7/209 , H05K2201/0382 , H05K2201/062 , H05K2201/066 , H05K2201/10272 , H05K2201/10409
摘要: A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.
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公开(公告)号:US09877394B2
公开(公告)日:2018-01-23
申请号:US15420875
申请日:2017-01-31
发明人: Franck Bordonado
IPC分类号: H05K1/00 , H05K1/18 , H01F27/06 , H01R4/02 , H01R12/70 , H01R12/75 , H01R25/16 , H02G5/02 , H01R4/48 , H01R11/28 , H01R12/58
CPC分类号: H05K1/181 , H01F27/06 , H01F2027/065 , H01R4/02 , H01R4/48 , H01R11/28 , H01R12/58 , H01R12/7088 , H01R12/75 , H01R25/165 , H01R2201/22 , H02G5/02 , H05K2201/1003 , H05K2201/10272
摘要: A mechanical and electrical connection system including a printed circuit board, a busbar and an electrical component, wherein the board includes a first orifice in which a bottom foot of the bar is received and includes a second orifice in which a lug of the component is received, and wherein the bar includes an elastically deformable clamp which receives the lug of the component.
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