公开(公告)号：US20190259647A1

公开(公告)日：2019-08-22

申请号：US16273808

申请日：2019-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  FANG JIE LIM ,  KARRTHIK PARATHITHASAN ,  ANAND MAHADEV ,  SHOJU VAYYAPRON ,  CHAI BOON XIAN

IPC: H01L21/683 ,  C23C14/50

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a deposition ring having an annular body; and a plurality of protrusions extending upwardly from the annular body and disposed about and equidistant from a central axis of the annular body, wherein an angle between a first protrusion and a second protrusion is between about 140° and about 180°.

公开(公告)号：US20190259635A1

公开(公告)日：2019-08-22

申请号：US16273390

申请日：2019-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： KARRTHIK PARATHITHASAN ,  FANG JIE LIM ,  ANAND MAHADEV ,  SHOJU VAYYAPRON ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH

IPC: H01L21/673 ,  H01L21/02 ,  H01L21/683

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a substrate carrier having a pocket configured to hold a substrate, wherein the pocket extends partially through a thickness of the substrate carrier; and wherein the pocket includes an annular trench disposed at a periphery of a floor of the pocket.

公开(公告)号：US20180144969A1

公开(公告)日：2018-05-24

申请号：US15815673

申请日：2017-11-16

Applicant: Applied Materials, Inc.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  SHOJU VAYYAPRON ,  ANAND MAHADEV ,  SHANKEERTHAN KALYANASUNDARAM ,  ENG SHENG PEH

IPC: H01L21/683 ,  H01L21/673

Abstract: Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.