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公开(公告)号:US20130044493A1
公开(公告)日:2013-02-21
申请号:US13657935
申请日:2012-10-23
Applicant: Applied Materials, Inc.
Inventor: JOSEPH M. RANISH , KHURSHED SORABJI , KEDARNATH SANGAM , ALEXANDER LERNER
IPC: F21V29/00
CPC classification number: F27B17/0025 , F27D5/0037 , F27D21/0014 , H01L21/67109 , H01L21/67115
Abstract: Embodiments of a lamphead and apparatus utilizing same are provided. In some embodiments, a lamphead for thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage, wherein the at least one heat transfer member extends into each coolant passage up to the full height of each coolant passage. The lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
Abstract translation: 提供了一种灯头和利用其的装置的实施例。 在一些实施例中,用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件,其中每个灯通道被配置为容纳灯,并且每个反射器腔被成形为充当 反射器或接收用于灯的可替换反射器,并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件,其从所述整体构件延伸到每个冷却剂通道中,其中所述至少一个传热构件延伸到每个冷却剂通道中直到每个冷却剂通道的全高度。 灯头可以设置在包括具有基板支撑件的处理室的设备中,其中灯头被定位成向基板支撑件提供能量。
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公开(公告)号:US20130153807A1
公开(公告)日:2013-06-20
申请号:US13764204
申请日:2013-02-11
Applicant: APPLIED MATERIALS, INC.
Inventor: CHANDRASEKHAR BALASUBRAMANYAM , HELDER LEE , MIRIAM SCHWARTZ , ELIZABETH WU , KEDARNATH SANGAM
IPC: F16K15/14
CPC classification number: F16K15/147 , C23C16/4401 , C23C16/45519 , F16K51/02 , H01L21/67772
Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.
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