公开(公告)号：US20230265561A1

公开(公告)日：2023-08-24

申请号：US17751273

申请日：2022-05-23

Applicant: Applied Materials, Inc.

Inventor： Zubin HUANG ,  Tomoharu MATSUSHITA ,  Cheng-Hsiung TSAI

IPC: C23C16/458 ,  H01L21/687 ,  C23C16/46

CPC classification number: C23C16/4585 ,  H01L21/68721 ,  C23C16/46

Abstract: A substrate support includes a monolithic body. The monolithic body includes a central portion and a peripheral portion. The central portion includes a top surface recessed with respect to the peripheral portion. A shadow ring is configured to sit directly upon an upper surface of the peripheral portion, and overlaps a portion of a substrate positioned upon the central portion. A heating element embedded within the central portion heats the central portion, the peripheral portion, and the shadow ring.

公开(公告)号：US20220099426A1

公开(公告)日：2022-03-31

申请号：US17530538

申请日：2021-11-19

Applicant: Applied Materials, Inc.

Inventor： Tomoharu MATSUSHITA ,  Aravind KAMATH ,  Jallepally RAVI ,  Cheng-Hsiung TSAI ,  Hiroyuki TAKAHAMA

IPC: G01B5/004 ,  H01L21/683 ,  H01L21/68

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.