公开(公告)号：US20230164367A1

公开(公告)日：2023-05-25

申请号：US17533642

申请日：2021-11-23

Applicant: Applied Optoelectronics, Inc.

Inventor： William G. MAHONEY ,  Simon FARFOUD ,  Steve BLASHEWSKI

IPC: H04N21/226

CPC classification number: H04N21/226

Abstract: An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.