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公开(公告)号：US12136796B2
公开(公告)日：2024-11-05
申请号：US17405416
申请日：2021-08-18
Applicant: Applied Optoelectronics, Inc.
Inventor： Dapeng Xu , Jin Huang , Huanlin Zhang
Abstract: The present disclosure is generally directed to an EML with a filter layer disposed between an active region of the EML and a substrate of the EML to absorb a portion of unmodulated light energy, and preferably the unmodulated light energy caused by transverse electric (TE) substrate mode. The filter layer preferably comprises a material with an energy band gap (Eg) that is less than the energy band gap of the predetermined channel wavelength to absorb unmodulated laser light.
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2.发明公开公开(公告)号：US20240275490A1
公开(公告)日：2024-08-15
申请号：US18437607
申请日：2024-02-09
Applicant: Applied Optoelectronics, Inc.
Inventor： Rafael CELEDON , Yi WANG , Tina MATHEWS , Ruru CHEN , Mark SIEJKA , Hang XIE , Ramesh NALLUR
IPC: H04B10/2575 , H04B10/25
CPC classification number: H04B10/25751 , H04B10/2589
Abstract: Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables and/or optical fiber) and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. In some embodiments, the primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.
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3.发明公开公开(公告)号：US20240080110A1
公开(公告)日：2024-03-07
申请号：US17901282
申请日：2022-09-01
Applicant: Applied Optoelectronics, Inc.
Inventor： Steven BLASHEWSKI
IPC: H04B17/00
CPC classification number: H04B17/0085
Abstract: A forward and reverse test point circuit with a switchable termination may be used to provide testing of forward and reverse RF signals in an RF amplifier before and/or after amplification. The switchable forward and reverse test point circuit includes at least one switchable termination circuit coupled between forward and reverse terminals of a directional coupler and at least one test point. During forward signal testing, the forward terminal is switched to the at least one test point and the reverse terminal is switched to a termination. During reverse signal testing, the reverse terminal is switched to the at least one test point and the forward terminal is switched to a termination. The RF amplifier including the switchable forward and reverse test point circuit may be used in a hybrid fiber-coaxial (HFC) network delivering CATV services and may be capable of amplifying RF signals up to 1.8 GHz.
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公开(公告)号：US11474311B1
公开(公告)日：2022-10-18
申请号：US17331911
申请日：2021-05-27
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Hao-Chiang Cheng , Ziliang Cai
Abstract: A parabolic reflector device (also referred to herein as a parabolic lens device) is disclosed which includes a plurality of parabolic lens members and a mirror member which couple together and collectively provide a light-transmissive structure for multiplexing or demultiplexing of an optical signal. The parabolic reflector device can be implemented within optical subassembly modules to support operations of transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs).
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公开(公告)号：US11320601B2
公开(公告)日：2022-05-03
申请号：US17031392
申请日：2020-09-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , John Cheng , Ziliang Cai
Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
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Patent Agency Ranking
公开(公告)号：US20220091350A1
公开(公告)日：2022-03-24
申请号：US17031362
申请日：2020-09-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , John CHENG , Ziliang CAI
IPC: G02B6/42 , H01R13/66 , H01R13/629
Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
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公开(公告)号：US20210159666A1
公开(公告)日：2021-05-27
申请号：US16693365
申请日：2019-11-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , Hang XIE , Ming QI
Abstract: In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
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公开(公告)号：US10989870B2
公开(公告)日：2021-04-27
申请号：US16116087
申请日：2018-08-29
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Kevin Liu , I-Lung Ho
Abstract: In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.
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公开(公告)号：US10950651B2
公开(公告)日：2021-03-16
申请号：US16202813
申请日：2018-11-28
Applicant: Applied Optoelectronics, Inc.
Inventor： Hsiu-Che Wang , Elsie Marentes , Qin Li
Abstract: The present disclosure is generally directed to an optical transceiver that includes a multi-channel on-board ROSA arrangement that includes an optical demultiplexer, e.g., an arrayed waveguide grating (AWG) and an array of photodiodes disposed on a same substrate. The array of photodiodes may be optically aligned with an output port of the optical demultiplexer and be configured to detect channel wavelengths and output a proportional electrical signal to an amplification circuit, e.g., a transimpedance amplifier. Each of the photodiodes can include an integrated lens configured to increase the alignment tolerance between the demultiplexer and the light sensitive region such that relatively imprecise bonding techniques, e.g., die bonding, may be utilized while still maintaining nominal optical power.
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公开(公告)号：US10928600B2
公开(公告)日：2021-02-23
申请号：US16664202
申请日：2019-10-25
Applicant: Applied Optoelectronics, Inc.
Inventor： Kevin Liu , Kai-Sheng Lin , Ziliang Cai
Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.
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