SYSTEM AND METHOD FOR MICROELECTRONICS LAMINATION PRESS
    1.
    发明申请
    SYSTEM AND METHOD FOR MICROELECTRONICS LAMINATION PRESS 审中-公开
    微电子层压机的系统与方法

    公开(公告)号:US20140096907A1

    公开(公告)日:2014-04-10

    申请号:US14100643

    申请日:2013-12-09

    Abstract: The system contains a lamination press. The first cavity is formed in a chassis. A film assembly is fitted within the chassis. A buffer mounts over the film assembly and within the chassis. A tool set is shaped to fit within the first cavity. The tool set and chassis are positioned within the lamination press to confer heat and pressure from the lamination press to the film assembly and chassis.

    Abstract translation: 该系统包含层压机。 第一腔形成在底盘中。 机箱内装有胶片组件。 缓冲器安装在胶片组件和底盘内。 工具组被成形为装配在第一腔内。 工具组和底盘位于层压机内,以将层压机的热和压力赋予薄膜组件和底盘。

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