公开(公告)号：US20130182180A1

公开(公告)日：2013-07-18

申请号：US13766443

申请日：2013-02-13

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Raymond J. Silva ,  Dennis P. Bowler ,  Gene A. Robillard

IPC: H01L25/065 ,  H04N5/225

CPC classification number: H01L25/065 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

Abstract: A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.

Abstract translation: 具有可扩展架构的复合焦平面组件具有多层双面氮化铝（AlN）基板和垂直架构，以实现焦平面和电子背板的双重功能。 成像芯片和其他电气元件安装在一个表面上，并且通过电触点矩阵在相对表面上提供直接背板连接。 在一个实施例中，柔性连接器夹在AlN焦平面之间，并且FR-4底板用于补偿AlN与商业上可获得的高密度电路卡连接器之间的热膨胀系数（CTE）的差异，其通常由 具有CTE性能的材料更接近于FR-4。 在替代实施例中，FR-4和柔性连接器通过使用由与AlN的CTE更匹配的材料制成的高密度电路卡连接器来消除。

公开(公告)号：US10129469B2

公开(公告)日：2018-11-13

申请号：US14201045

申请日：2014-03-07

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Raymond J. Silva ,  Gerard M. Perron

IPC: H01J3/14 ,  H04N5/232 ,  G02B13/22 ,  G02B13/00 ,  G02B7/02 ,  G02B13/06 ,  H04N5/33 ,  H04N5/247 ,  H04N5/225

Abstract: A surveillance sensor system is described. The surveillance sensor system includes a polygonal-shaped assembly having four substantially identical quadrant segments. Each of the quadrant segments includes a first set of lens, a second set of lens, and a third set of lens. Images captured by the first, second and third sets of lens can be combined to form a telecentric image on an intermediate image plane. The surveillance sensor system also includes a relay optic module having a set of lens, multiple focal plane array detectors and a dewar. The relay optic module can re-image the telecentric image located on the intermediate image plane onto an image plane.

公开(公告)号：US09164357B1

公开(公告)日：2015-10-20

申请号：US13948471

申请日：2013-07-23

Applicant: BAE SYSTEMS Information And Electronic Systems Integration Inc.

Inventor： Raymond J. Silva ,  Gerard M. Perron ,  Scott A. Derushia ,  James D. Targove

IPC: G02F1/03 ,  G03B11/00 ,  H04N5/225 ,  G02B5/23 ,  G02F1/01

CPC classification number: G03B11/00 ,  G02B5/23 ,  G02F1/0126 ,  H04N5/238

Abstract: A system and method for enhanced conditioning light so a camera can capture images from it in a variety of brightness ranges is presented. A camera has an optical lens and a photochromic filter. The photochromic filter may be placed in front of the lens. The photochromic filter extends an exposure range of the camera without the need for a mechanical iris.

Abstract translation: 提出了一种用于增强调节光的系统和方法，使得相机可以以各种亮度范围从其捕获图像。 相机具有光学透镜和光致变色滤光片。 光致变色滤光片可以放置在透镜的前面。 光致变色滤光片延长了相机的曝光范围，无需机械光圈。

公开(公告)号：US09070566B2

公开(公告)日：2015-06-30

申请号：US13766443

申请日：2013-02-13

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Raymond J. Silva ,  Dennis P. Bowler ,  Gene A. Robillard

IPC: H04N3/14 ,  H04N5/335 ,  H01L25/065 ,  H04N5/225

CPC classification number: H01L25/065 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

Abstract: A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.

Abstract translation: 具有可扩展架构的复合焦平面组件具有多层双面氮化铝（AlN）基板和垂直架构，以实现焦平面和电子背板的双重功能。 成像芯片和其他电气元件安装在一个表面上，并且通过电触点矩阵在相对表面上提供直接背板连接。 在一个实施例中，柔性连接器夹在AlN焦平面之间，并且FR-4底板用于补偿AlN与商业上可获得的高密度电路卡连接器之间的热膨胀系数（CTE）的差异，其通常由 具有CTE性能的材料更接近于FR-4。 在替代实施例中，FR-4和柔性连接器通过使用由与AlN的CTE更匹配的材料制成的高密度电路卡连接器来消除。