公开(公告)号：US10354906B2

公开(公告)日：2019-07-16

申请号：US15558378

申请日：2017-03-02

申请人： BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

发明人： Chih-Wei Su

IPC分类号： H01L21/00 ,  H01L21/683 ,  H01L21/673 ,  H01L21/687

摘要： A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.

公开(公告)号：US20180096876A1

公开(公告)日：2018-04-05

申请号：US15558378

申请日：2017-03-02

申请人： BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

发明人： Chih-Wei Su

IPC分类号： H01L21/683 ,  H01L21/673 ,  H01L21/687

CPC分类号： H01L21/6835 ,  H01L21/6734 ,  H01L21/67346 ,  H01L21/6875 ,  H01L2221/68318 ,  H01L2221/68381

摘要： A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.