公开(公告)号：US12106988B2

公开(公告)日：2024-10-01

申请号：US17651718

申请日：2022-02-18

申请人： Daewon Semiconductor Packaging Industrial Company

发明人： Sunna Chung ,  Ryan Park ,  Jin Chae ,  Matthew Stanton Whitlock ,  Jonathan Kevin Lie ,  Athens Okoren

IPC分类号： B65D85/48 ,  H01L21/673

CPC分类号： H01L21/67383 ,  H01L21/67346 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67326

摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

公开(公告)号：US20240242990A1

公开(公告)日：2024-07-18

申请号：US18301291

申请日：2023-04-17

申请人： Ciena Corporation

发明人： Simon Savard ,  Raphael Beaupré-Laflamme ,  François Pelletier

IPC分类号： H01L21/673 ,  B25B11/00 ,  H01L21/683

CPC分类号： H01L21/67346 ,  B25B11/005 ,  H01L21/6838

摘要： An apparatus for securing a wafer, the wafer having a first side comprising a plurality of fabricated structure regions and a second side that has at least one region that is exposed for fabrication when the wafer is secured, comprises: a carrier base configured to receive the wafer, the carrier base comprising one or more alignment features for aligning the wafer to the carrier base; and a plurality of support structures arranged on the carrier base. Three or more of the support structures are each configured to contact the first side of the wafer when the wafer is secured to the carrier base, and arranged on the carrier base to contact the first side of the wafer at a location on the first side of the wafer that is between at least two of the plurality of fabricated structure regions.

公开(公告)号：US20230360940A1

公开(公告)日：2023-11-09

申请号：US17735623

申请日：2022-05-03

申请人： Applied Materials, Inc.

发明人： Jason A. Rye

IPC分类号： H01L21/673

CPC分类号： H01L21/67346 ,  H01L21/67326 ,  H01L21/67313

摘要： Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.

公开(公告)号：US11810804B2

公开(公告)日：2023-11-07

申请号：US17691042

申请日：2022-03-09

申请人： Vanguard International Semiconductor Corporation

发明人： Hsiu-Mei Yu ,  Wei-Chan Chang ,  Chang-Sheng Lin ,  Chun-Yi Wu

IPC分类号： H01L21/02 ,  H01L21/673 ,  H01L23/495 ,  H01L21/302

CPC分类号： H01L21/67356 ,  H01L21/67346 ,  H01L23/49513 ,  H01L21/302

摘要： A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

公开(公告)号：US20230343622A1

公开(公告)日：2023-10-26

申请号：US18127020

申请日：2023-03-28

申请人： Hitachi High-Tech Corporation

发明人： Takanori KATO ,  Masaki MIZUOCHI ,  Motohiro TAKAHASHI ,  Hironori OGAWA

IPC分类号： H01L21/673 ,  H01L21/687 ,  H01L21/68

CPC分类号： H01L21/67346 ,  H01L21/6875 ,  H01L21/68764 ,  H01L21/681

摘要： Provided is a stage apparatus including: a first table that is movable on a base; a second table that is movable in a state of floating above the first table and includes a first portion and a second portion below the first portion; a first position measuring device that measures a position of the first portion of the second table; a second position measuring device that measures a position of the second portion of the second table; and a computer that controls a motor that drives the second table. The computer drives the second table based on information on the position of the first portion measured by the first position measuring device and information on the position of the second portion measured by the second position measuring device.

公开(公告)号：US20230197487A1

公开(公告)日：2023-06-22

申请号：US18112466

申请日：2023-02-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Bo Hua CHEN ,  Yan Ting SHEN ,  Fu Tang CHU ,  Wen-Pin HUANG

IPC分类号： H01L21/673 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L21/67346 ,  H01L23/562 ,  H01L21/78

摘要： A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

公开(公告)号：US20190074203A1

公开(公告)日：2019-03-07

申请号：US16185541

申请日：2018-11-09

申请人： MURATA MACHINERY, LTD.

发明人： Thomas SCHOBER ,  Bernd RAHRBACH ,  Christian WOHANKA ,  Yves FENNER ,  Gerhard DOVIDS ,  John FIDDES

IPC分类号： H01L21/673

CPC分类号： H01L21/67346 ,  H01L21/67376 ,  H01L21/67389 ,  H01L21/67393

摘要： A substrate carrier stack includes substrate carriers which are stacked or stackable on each other and carry substrates within an inner accommodation space of the substrate carrier stack. The substrate carrier stack includes at least one first purging channel and at least one second purging channel, which extend vertically parallel to the inner accommodation space at opposing sides thereof, and purging structures which enable horizontal purging flows within the substrate carrier stack through spaces between substrates held by the substrate carriers. The substrate carriers each include an outer carrier frame provided with a seat to carry a substrate, wherein the outer carrier frame extends around the first and second purging channels and the inner accommodation space.

公开(公告)号：US10014228B2

公开(公告)日：2018-07-03

申请号：US14944839

申请日：2015-11-18

申请人： Rudolph Technologies, Inc.

发明人： James H. Greer ,  Troy Palm

IPC分类号： H01L21/66 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01L21/673

CPC分类号： H01L22/12 ,  H01L21/67288 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6838 ,  H01L21/68714 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/6875

摘要： A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.

公开(公告)号：US20180096876A1

公开(公告)日：2018-04-05

申请号：US15558378

申请日：2017-03-02

申请人： BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

发明人： Chih-Wei Su

IPC分类号： H01L21/683 ,  H01L21/673 ,  H01L21/687

CPC分类号： H01L21/6835 ,  H01L21/6734 ,  H01L21/67346 ,  H01L21/6875 ,  H01L2221/68318 ,  H01L2221/68381

摘要： A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.

公开(公告)号：US20170309508A1

公开(公告)日：2017-10-26

申请号：US15613879

申请日：2017-06-05

申请人： Micron Technology, Inc.

发明人： Oh Seung Min

IPC分类号： H01L21/68 ,  H01L21/683 ,  H01L21/677 ,  H01L21/673 ,  C23C14/04 ,  C23C16/458 ,  C23C16/04 ,  C23C14/50 ,  H01L31/18

CPC分类号： H01L21/682 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  G11C5/02 ,  G11C7/10 ,  G11C7/1012 ,  G11C7/1066 ,  G11C7/1069 ,  G11C7/1084 ,  G11C7/1093 ,  G11C2213/71 ,  H01L21/6734 ,  H01L21/67346 ,  H01L21/67706 ,  H01L21/67736 ,  H01L21/681 ,  H01L21/6838 ,  H01L23/48 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L31/18 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/1301 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller configured to control the interface with control data received from at least one of the plurality of memory dies. The interface device of the memory device is configured to divide and multiplex an IO channel between the memory die package and the memory controller into more than one channel using the control data receive from the at least one of the plurality of memory dies. The interface device for a memory device includes a control input buffer configured to receive an enable signal through a control pad, a first input buffer configured to receive a first data through a first IO pad in response to a first state of the enable signal, and a second input buffer configured to receive a second data through a second IO pad in response to a second state of the enable signal. The interface device further includes an input multiplexer configured to multiplex the first data and the second data to provide an input data.