公开(公告)号：US20210400831A1

公开(公告)日：2021-12-23

申请号：US17281189

申请日：2019-05-16

Applicant: BYD COMPANY LIMITED

Inventor： Lan MA ,  Haiyan JIN ,  Ling PAN ,  Na YU ,  Liang CHEN

IPC: H05K5/06 ,  H05K5/02 ,  C03C8/24 ,  C03C8/08 ,  C04B37/04 ,  H04M1/02

Abstract: An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

公开(公告)号：US20220104376A1

公开(公告)日：2022-03-31

申请号：US17418530

申请日：2019-04-29

Applicant: BYD COMPANY LIMITED

Inventor： Lan MA ,  Haiyan JIN ,  Liang CHEN

IPC: H05K5/03 ,  H04B1/3888

Abstract: An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.