公开(公告)号：US20240021786A1

公开(公告)日：2024-01-18

申请号：US18476694

申请日：2023-09-28

Applicant: BYD COMPANY LIMITED

Inventor： Xinjun JIANG ,  Baosheng ZHANG

IPC: H01M4/139 ,  H01M4/04 ,  H01M50/533 ,  H01M50/534

CPC classification number: H01M4/139 ,  H01M4/0404 ,  H01M50/533 ,  H01M50/534 ,  H01M2004/028

Abstract: A method for preparing a positive electrode plate, a positive electrode plate, and a battery including same. The method for preparing a positive electrode plate includes: providing a current collector, the current collector including a coating region and a non-coating region; coating a positive-electrode active material on the coating region of the current collector; cutting the non-coating region at intervals along a length direction of the non-coating region to form a tab between every two adjacent cutting positions, an edge of a region of the positive-electrode active material corresponding to the cutting position being cut off at each cutting; and coating an electrically insulating adhesive on an edge of the positive-electrode active material between every two adjacent cutting positions.

公开(公告)号：US20230052214A1

公开(公告)日：2023-02-16

申请号：US17977043

申请日：2022-10-31

Applicant: BYD COMPANY LIMITED

Inventor： Xinjun JIANG ,  Jian ZHANG ,  Lei LEI

IPC: H01M4/70 ,  H01M50/46

Abstract: An electrode sheet includes a current collector and a first active material layer coated on a first surface of the current collector. The first active material layer includes a first groove, and the first groove includes a first side wall, a second side wall, and a third side wall. The first side wall and the second side wall are arranged parallel to each other, and the third side wall connects the first side wall and the second side wall. The first groove has a width that is a distance from the first side wall to the second side wall, and a length of a surface contour of a cross-section view of the third side wall is greater than the width of the first groove.

公开(公告)号：US20230347450A1

公开(公告)日：2023-11-02

申请号：US18006523

申请日：2021-07-19

Applicant: BYD COMPANY LIMITED

Inventor： Xinjun JIANG ,  Xiaobo TANG ,  Xiaoyong ZHANG ,  Jian ZHANG ,  Jianjun WANG

IPC: B23K26/38 ,  H01M4/139 ,  H01M4/04

CPC classification number: B23K26/38 ,  H01M4/139 ,  H01M4/0471

Abstract: The present disclosure discloses a method and device for forming a groove on an electrode plate. The method for forming a groove on an electrode plate includes: thinning an active material layer by a laser method, where the active material layer is located in a to-be-grooved area of the electrode plate; and removing the thinned active material layer by a physical removal method to form an accommodating groove that exposes the current collector layer. By adopting a combination of the laser method and the physical removal method, the present disclosure, the present disclosure, on the one hand, can quickly remove the active material layer in the to-be-grooved area, and on the other hand, can avoid damaging the current collector layer. This ensures the processing precision, speeds up the production and improves the product yield.

公开(公告)号：US20230048047A1

公开(公告)日：2023-02-16

申请号：US17977821

申请日：2022-10-31

Applicant: BYD COMPANY LIMITED

Inventor： Xinjun JIANG ,  Jian ZHANG ,  Lei LEI

IPC: H01M10/0587 ,  H01M4/13

Abstract: An electrode sheet includes a current collector and a first active material layer on a first surface of the current collector. The first active material layer includes a main portion and a first buffer portion. The main portion includes a first inner surface and an outer surface. The first inner surface is attached to the current collector, and the outer surface is parallel to the first inner surface. The first active material layer has a height that is a vertical distance from the outer surface to the first inner surface. The first buffer portion includes a second inner surface, a buffer surface, and an inner wall surface defining a first groove. A first end of the buffer surface is connected to the outer surface, a second end of the buffer surface is connected to the inner wall surface. The inner wall surface is shorter than the first active material layer.